Beijing Boe Display Technology Co., Ltd.

Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Guangdong Shi

Lianjie Qu

Yonglian Qi

Hebin Zhao

Shuai Liu

Bingqiang Gui

Shan Zhang

Yun Qiu

Tao Liu

Xiaoling Xu

Xue Feng Gao

Chao Liu

Bin Yan

Ruizhi Yang

Kun Lu

Ning Jia

Xing Zhou

Minqi Chen

Weiwei Tong

Xiaogai Chun

Shiyu Xu

Xianxue Yang

A method for manufacturing a side wire for a substrate and a substrate structure are provided. The method includes: forming a plurality of first pattern structures on a side surface of the substrate, wherein a gap between any adjacent two of the plurality of first pattern structures connects a top surface and a bottom surface of the substrate to each other; forming a conductive material film covering the side surface of the substrate; and removing the plurality of first pattern structures and a portion of the conductive material film that is attached on the plurality of first pattern structures, and maintaining a portion of the conductive material film that is located between any adjacent two of the plurality of first pattern structures as the side wire.

Method for manufacturing side wire for substrate and substrate structure

A method of forming an array substrate, the array substrate and a display device are provided. The method of forming the array substrate includes: in a case that a display unit is formed on one of two opposite surfaces of a base substrate and a driving circuit is formed on the other of the two opposite surfaces of the base substrate, performing a roughening treatment on edge regions of the two opposite surfaces of the base substrate and a side surface of the base substrate connecting the edge regions of the two opposite surfaces, to form a roughened region; and forming, at the roughened region, a metal wiring connecting a signal input terminal of the display unit and a signal output terminal of the driving circuit.

Method of forming array substrate, array substrate and display device

The present application provides an optical modulating device having a light transmissive region and a light blocking region. The optical modulating device includes a base substrate; a plurality of protrusions on the base substrate in the light transmissive region and configured to allow light emitting out of a side of the optical modulating device; and a reflective layer on the base substrate in the light blocking region and configured to block light from emitting out of the side of the optical modulating device.

Optical modulating device, back light module, display apparatus, and fabricating method thereof

The display apparatus includes a plurality of sub-pixels. The control method includes: calculating a compensation data signal of each compensation sub-pixel according to a position of at least one dead sub-pixel adjacent to the compensation sub-pixel in the display apparatus, a data signal of each dead sub-pixel adjacent to the compensation sub-pixel in a current frame image, and a number of compensation sub-pixels in all sub-pixels that have a same emission color as and are adjacent to each dead sub-pixel; calculating a total data signal for the compensation sub-pixel according to a data signal of the compensation sub-pixel in the current frame image and the calculated compensation data signal of the compensation sub-pixel; and inputting the total data signal to the compensation sub-pixel when the current frame image is displayed.

Display apparatus and control method thereof

The present application discloses an array substrate, a display apparatus and a method of fabricating an array substrate. The array substrate has a plurality of first bottom-gate type thin film transistors each of which including a metal oxide active layer and a plurality of second bottom-gate type thin film transistors each of which including a silicon active layer.

Array substrate, display apparatus, and method of fabricating array substrate

A display panel, fabrication method thereof, and a display device. The display panel includes a substrate and a plurality of pixels disposed on the substrate; each pixel includes a pixel circuit disposed on the substrate; the display panel further includes a pixel defining layer covering the pixel circuit; a surface of the pixel defining layer facing away from the pixel circuit is provided with a plurality of grooves; the plurality of grooves are in one-to-one correspondence with the plurality of pixels; each of the grooves is provided with a light emitting diode electrically connected to the pixel circuit.

Display panel, fabrication method thereof, and display device

The present disclosure provides a circuit substrate, a method for manufacturing the same, a display substrate and a tiled display device. The circuit substrate includes: a base substrate; a driving circuit on the base substrate; and conductive connection portions. A plurality of grooves is defined in a lateral side of the base substrate; each of the plurality of grooves extends through a top surface and an opposite bottom surface of the base substrate. The driving circuit includes signal lines on the top surface of the base substrate and signal-line leads on the bottom surface of the base substrate. The plurality of conductive connection portions are corresponding to the plurality of grooves in a one-to-one manner; at least one part of the conductive connection portion is in the corresponding groove. The conductive connection portion is connected with the corresponding signal line and the corresponding signal-line lead, respectively.

Circuit substrate, method for manufacturing the same, display substrate and tiled display device

The present application discloses a method of fabricating an array substrate. The method includes forming a first conductive material layer on a base substrate; forming an insulating layer on a side of the first conductive material layer distal to the base substrate, the insulating layer formed to cover a first part of the first conductive material layer, exposing a second part of the first conductive material layer; over-etching the first conductive material layer to remove the second part of the first conductive material layer, and remove a portion of a periphery of the first part of the first conductive material layer to form a recess between the insulating layer and the base substrate, thereby forming a first electrode; and subsequent to forming the first electrode and the recess, annealing the insulating layer to mobilize a portion of the insulating layer above the recess and fill the recess with a mobilized insulating material.

Method of fabricating array substrate, array substrate, and display apparatus thereof

This disclosure relates to a field-effect transistor and a production method thereof, an array substrate and a production method thereof, and a display panel. The production method comprises: forming an active layer on a substrate; forming a gate electrode insulating layer on the active layer to define a gate electrode area as well as a source electrode area and a drain electrode area located on two sides of the gate electrode area on the active layer; applying a gate electrode layer to cover surfaces of the active layer and the gate electrode insulating layer; patterning the gate electrode layer to form a first contact electrode, a second contact electrode, and a gate electrode, wherein the first contact electrode is located on the source electrode area, the second contact electrode is located on the drain electrode area, and the gate electrode is located on the gate electrode insulating layer.

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Beijing, China

Guangdong Shi