Boe Technology Group Co., Ltd.

Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

South China University of Technology

Beijing Boe Display Technology Co., Ltd.

Fuzhou Boe Optoelectronics Technology Co., Ltd.

Boe Technology Group

Guangcai Yuan

Xue Dong

Zhanfeng Cao

Dongfang Wang

Ce Ning

Qi Yao

Xin Gu

Zhiwei Liang

Haixu Li

Shi Shu

Ke Fei Wang

Tongshang Su

Yingwei Liu

Liangchen Yan

Ce Zhao

Hehe Hu

Feng Guan

Qinghe Wang

Zhijun Lv

Haitao Huang

Leilei Cheng

Bin Zhou

Jun Cheng

Chuanxiang Xu

Zhongyuan Sun

Lei Wang

Wei Li

Feng Zhang

Yong Yu

Guangyao Li

Peng Liu

Chao Li

Ming Wang

Jun Feng Liu

Hua Yin Huang

Zhichong Wang

Zhengliang Li

Dejiang Zhao

Jinxiang Xue

Yang Zhang

Lei Chen

Chen Hui Xu

Zhi Hu Wang

Wei Yang

Ning Liu

Fuqiang Li

Qi Qi

Chunsheng Jiang

Minghua Xuan

Dongni Liu

Jing Li

Dongsheng Li

Xiao Lin Zhang

Libo Wang

Zhiqiang Jiao

Liwen Dong

Wenbin Jia

Xinwei Gao

Yongqian Li

Gang Wang

Xin Yang

Feng Qu

Wei He

Li Li

Fei Wang

Kai Xu

Song Liu

Wenqu Liu

Xiaochuan Chen

Wei Wang

Wei Liu

Xi Chen

Jianbo Xian

Liang Chen

Can Zhang

Li Xiao

Jianguo Wang

Pan Xu

Zheng Liu

Can Wang

Chunping Long

Zhongyuan Wu

Haoliang Zheng

Han Yue

Jing Liu

Yun Qiu

Xiang Sean Zhou

Shijun Wang

Wei Peng Huang

Yi Chen

Liye Duan

Tong Yang

Pengxia Liang

Lijun Yuan

Lei Zhao

Wenjun Xiao

Liangliang Li

Xiaolong He

Ying Zhao

Fangzhen Zhang

A back plate and a manufacturing method thereof, a method for bonding a chip, and a display device are provided. The back plate includes: a base substrate; and, a plurality of conductive connecting tubes disposed on the base substrate, wherein one end of each of the conductive connecting tubes is connected to the base substrate, and a side wall of each of the conductive connecting tubes is provided with an opening penetrating the side wall. And, the method for bonding a chip includes: providing the back plate; inserting an electrode of the chip into a corresponding conductive connecting tube from an end of the conductive connecting tube away from the base substrate; and heating the conductive connecting tube and the chip, so that the electrode of the chip is electrically connected to the conductive connecting tube.

Back plate and manufacturing method thereof, method for bonding chip, and display device

A micro-nano channel structure, a method for manufacturing the micro-nano channel structure, a sensor, a method for manufacturing the sensor, and a microfluidic device are provided. The micro-nano channel structure includes: a base substrate; a base layer, on the base substrate and including a plurality of protrusions; a channel wall layer, on a side of the plurality of the protrusions away from the base substrate, the channel wall layer has a micro-nano channel; a recessed portion is provided between adjacent protrusions of the plurality of the protrusions, an orthographic projection of the micro-nano channel on the base substrate is located within an orthographic projection of the recessed portion on the base substrate. The micro-nano channels have a high resolution or an ultra-high resolution, and have different sizes and shapes.

Micro-nano channel structure, sensor and manufacturing method thereof, and microfluidic device

A display panel includes a light-emitting substrate, an opposite substrate, and an intermediate layer assembly between the light-emitting substrate and the opposite substrate. The light-emitting substrate has a light-emitting surface configured to allow light to be emitted from, and the light emitted from the light-emitting surface is directed to the opposite substrate. The intermediate layer assembly includes a thin film encapsulation layer, a filler layer, and an overcoat that are sequentially stacked in a pointing direction vertically pointing from the light-emitting substrate to the opposite substrate. The thin film encapsulation layer includes at least two encapsulation sub-layers that are stacked in the pointing direction. In the pointing direction, refractive indexes of the encapsulation sub-layers gradually increase. A refractive index of the overcoat is higher than a refractive index of the filler layer.

Display panel and display apparatus

A display panel, a manufacturing method thereof, and a display device. The manufacturing method comprises: sequentially forming a sacrificial layer and a flexible substrate on a surface of a side of a rigid base plate; forming a connection-via pair in the flexible substrate; forming a conductive layer on the flexible substrate, and forming connection portions; forming a leveling layer; forming driving circuits corresponding one-to-one to the connection-via pairs on the flexible substrate, and forming a driving chip on a side of the driving circuits facing away from the flexible substrate, the driving chip being electrically connected to the driving circuits; separating the sacrificial layer from the flexible substrate; and forming a micro LED device on a surface of the flexible substrate facing away from the driving circuits, the micro LED device being electrically connected to the connection portions.

Display panel, manufacturing method thereof, and display device

An array substrate includes a base substrate, a driving circuit layer, and a functional device layer which are sequentially stacked; the driving circuit layer is provided with first driving circuits, and each first driving circuit at least includes a driving transistor; and the driving circuit layer includes a first gate layer, a first gate insulation layer, a semiconductor layer, a second gate insulation layer, a second gate layer, an interlayer dielectric layer, and a source-drain metal layer which are sequentially stacked on one side of the base substrate.

Array substrate and display panel including electrically connected gates

A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

Display backboard and manufacturing method thereof and display device

The display substrate includes a base substrate () including a display area (AA) and a peripheral area (BB) on at least one side of the display area (AA); and an infrared sensor () on the base substrate (). The infrared sensor () is integrated in the peripheral area (BB). The infrared sensor () includes a first electrode (), a photoelectric conversion function layer () and a second electrode () that are arranged in a stacked manner. The first electrode () is arranged adjacent to the base substrate (), the second electrode () is made of a transparent conductive material, and the infrared sensor () collects infrared rays reflected by an eye from a side where the second electrode () is located.

Display substrate, display panel, and near-eye display device and display method thereof

A polarizer, an electronic device and a method of preparing the polarizer are provided. The polarizer includes a base substrate and a metal wire grid structure provided on the base substrate. The metal wire grid structure includes a plurality of metal wire grid layers and one or more dielectric layers stacked between adjacent metal wire grid layers of the metal wire grid layers. Each of the plurality of metal wire grid layers includes a plurality of metal wire strips periodically arranged in a first direction parallel to a surface of the base substrate, and each of the plurality of metal wire grid layers is stacked in a second direction perpendicular to the surface of the base substrate, and a period of the metal wire strips in each of the plurality of metal wire grid layers is less than or equal to 300 nm.

Polarizer, electronic device and method of preparing polarizer

A display panel and a display device are provided that relate to the technical field of display. The display panel has a first display area and at least one second display area at a side of the first display area, and a transmittance of the second display area is greater than that of the first display area. The display panel includes a base substrate, a driving circuit layer and a pixel light-emitting layer which are sequentially laminated. The base substrate includes at least one organic material layer which is provided with a first groove at least partially overlapping with the second display area. A thickness of a part of the at least one organic material layer close to the first groove gradually decreases from the first display area to the second display area. The display panel can improve the accuracy of a sensing result of the photosensitive assembly.

Display panel and display device for increased transmittance

An array substrate and a display panel. The array substrate includes: a base substrate; a gate line and a data line on the base substrate, the gate line intersect the data line to define a pixel region; a metal oxide thin film transistor is arranged in the pixel region, the metal oxide thin film transistor includes a metal oxide semiconductor layer; the metal oxide semiconductor layer includes a first part and a second part; the first part and the data line are connected through a first via hole; the first part is in a stripe shape; a first included angle is between extension directions of the first part and the data line; an orthographic projection of the second part overlap with an orthographic projection of the gate line on the base substrate and do not overlap with an orthographic projection of the data line on the base substrate.

Array substrate and display panel

A photodetection backplane, a liquid crystal display panel and a liquid crystal display apparatus are provided. The photodetection backplane includes: a base substrate; a first organic switching unit arranged at a side of the base substrate; and an organic photodetector arranged at a same side of the base substrate as the first organic switching unit. The organic photodetector is electrically connected to the first organic switching unit, and at least one film layer of the organic photodetector and a film layer of the first organic switching unit are arranged in a same layer and made of a same material.

Photoelectric detection backplate, liquid crystal display panel and liquid crystal display apparatus

An array substrate and a manufacturing method therefor, and a display apparatus are provided. The array substrate includes an underlay substrate, and at least one first transistor, at least one data line and at least one pixel electrode disposed on the underlay substrate. The at least one first transistor includes a first active layer and a first gate; the first gate is located on a side of the first active layer away from the underlay substrate, and orthographic projections of the first gate and the first active layer on the underlay substrate are at least partially overlapped. The first active layer is electrically connected to the data line and the pixel electrode, respectively. The data line is located on a side of the first active layer close to the underlay substrate, and the pixel electrode is located on a side of the first gate away from the underlay substrate.

Array substrate and manufacturing method therefor, and display apparatus

A display substrate includes a base substrate, a pixel definition layer, an isolation layer, and an isolated layer. The pixel definition layer includes pixel openings penetrating through the pixel definition layer. The isolation layer is not overlapping with the pixel openings. The isolation layer includes a first isolation portion and a second isolation portion. A slope angle formed by at least one side edge and a bottom edge in a cross section of the second isolation portion is an obtuse angle. There is a gap between the first isolation portion and the second isolation portion at the obtuse angle. The isolated layer includes a first isolated portion covering the isolation layer, and a second isolated portion and a third isolated portion on both sides of the first isolation portion respectively. The thickness of the first isolation portion is larger than the thickness of the isolated layer.

Display substrate and manufacturing method therefor, and display panel and display device

A display substrate (), including a flexible substrate body, a thickness adjustment layer (), and a micro-lens layer (). The flexible substrate body includes: a plurality of island-shaped display regions () spaced apart from each other, a hollow region () disposed between adjacent island-shaped display regions (), and a connection region () for connecting the adjacent island-shaped display regions (). The thickness adjustment layer () is disposed on light exit sides of the plurality of island-shaped display regions () of the flexible substrate body. The micro-lens layer () is disposed on the side of the thickness adjustment layer () away from the flexible substrate body.

Display substrate and preparation method therefor, and display device

The present application relates to the technical field of display, and discloses an OLED display panel and a display device. The OLED display panel includes a drive backplane; and an OLED device, an encapsulation structure and a color resistor structure which are arranged on the drive backplane; the encapsulation structure and the color resistor structure are located on a side, facing away from the drive backplane, of the OLED device, and the color resistor structure includes a chromatic color resistor layer, a first BM and a second BM; and the first BM is located on a side, facing away from the drive backplane, of the chromatic color resistor layer, and the second BM is located on a side, facing the drive backplane, of the chromatic color resistor layer.

Oled display panel and display device

Growing community of inventors

Beijing, China

Guangcai Yuan