Ruggedcom Inc.

Hyperion Sensors Inc.

Is5 Communications, Inc.

Systems with Intelligence Inc.

Siemens Canada Limited

Guang Zeng

Yuri Luskind

Gerald Manuelpillai

Ilya Tchaplia

Roger Moore

Anselm Viswasam

Phil Levy

Clive Dias

Nick DiPardo

Philip Levy

Adjustable arm magnetic mount

Sensing methods and systems for transformers, and the construction thereof, are described herein. Example transformer systems and example methods for constructing a core for the system are disclosed. The example system includes a core with a bottom plate, two or more limbs mounted to the bottom plate and a top plate enclosing the core. At least one of the bottom plate, the limbs and the top plate is formed with a sensing component therein. The sensing component can be mounted to a spacer layer assembled within a stack of laminated layers. The sensing component can be mounted within a path defined within the spacer layer, for example. Methods for detecting operating conditions within the transformer are also disclosed.

Optical sensing methods and systems for transformers, and the construction thereof

Optical sensing methods and systems for power applications, and the construction thereof, are described herein. An example method of constructing a winding assembly includes mounting a sensing component to a coil former, and winding a coil onto the coil former so that the sensing component is positioned within the coil. A system and method for detecting operating conditions within a transformer using the described winding assemblies are described.

Optical sensing methods and systems for power applications, and the construction thereof

The present invention relates an environmentally robust chassis design for use in high demand or mission critical environments, including power stations, sub-stations, roadside transportation, rail, and industrial applications. The present invention provides a) increased cooling and reliability for the components of electronic equipment, more particularly electronic components, which could affect the power supply, data transmission; and b) increased tolerance to excessive shock and vibration (e.g. can withstand over 20 G of force).

Symmetrical and orthogonal component design

An open frame chassis has a top opening and a bottom opening permitting ambient airflow. A plurality of modules, each enclosing electrical components in thermal contact with a heat sink area of their corresponding module, can each be inserted in the chassis. Ambient air may flow from the bottom opening across the heat sink area of each module to the top opening to passively cool the modules and electrical components. Key pins guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot. Guide pins on corners of the modules mate with guide holes in the chassis to secure the module to the chassis and decrease vibration. Both sides of the chassis have side openings through which the fins of the modules in the end slots of the chassis may be exposed.

Open frame electronic chassis for enclosed modules

An open frame chassis has a top opening and a bottom opening permitting ambient air flow there through. A plurality of modules, each enclosing electrical components which are in thermal contact with a heat sink area of their corresponding module, and each of which can be inserted to an inserted position in the open frame chassis. When the modules are inserted into the open frame chassis, ambient air may flow from the bottom opening of the chassis across the heat sink area of each module to the top opening in order to passively cool the modules and the electrical components enclosed therein. The heat sink area has fins which are separated by a distance of 9 mm to 12 mm and have a height 10 mm to 20 mm. Key pins are associated with the electrical connectors of the chassis to guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot. Guide pins are present on the corners of the modules to mate with guide holes in the chassis to secure the module to the open frame chassis and decrease vibration. Both sides of the chassis have side openings through which the fins of the modules inserted into the end slots of the chassis may be exposed. The power modules are inserted into the end slots. The chassis has an inverted connection at one end slot to accommodate identical power modules at both end slots such that the heat sink area always faces a side opening in the open frame chassis.

An anchoring member and related method are disclosed for substantially parallel assembly of two additional daughter printed circuit boards (PCB) and heat sink on each side of main of mother PCB, and to retain a predetermined mating distance thereto to retain a predetermined mating distance thereto. The anchoring member comprises an elongated body extending in a longitudinal direction and having a first coupling member on one end for coupling the first daughter board in a substantially perpendicular orientation to the longitudinal direction on a first side of the mother board. The elongated body also comprises a second coupling member at the opposite end from the elongated body from the first coupling member for coupling the second daughter board in a substantially perpendicular orientation to the longitudinal direction on a second side of the mother board. The elongated body also has a positioning flange for positioning the elongated body in an aperture of the mother board at an inserted position and a friction fit surface for interacting with the aperture of the mother board to secure the elongated body in the inserted position.

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Mississauga, Canada

Guang Zeng