Infineon Technologies Ag

Infineon Technologies Austria Ag

Guan Choon Matthew Nelson Tee

Joachim Mahler

Chau Fatt Chiang

Swee Kah Lee

Kok Yau Chua

Soon Lock Goh

Beng Keh See

Thorsten Meyer

Klaus Schiess

Chee Yang Ng

Mei Chin Ng

Sook Woon Chan

Chan Lam Cha

Wei Han Koo

Milad Mostofizadeh

Edward Andrew Jones

A method of manufacturing a package, comprising embedding the semiconductor chip with an encapsulant comprising a transition metal in a concentration in a range between 10 ppm and 10,000 ppm; selectively converting of a part of the transition metal, such that the electrical conductivity of the encapsulant increases; and plating the converted part of the encapsulant with an electrically conductive material.

Manufacturing a package using plateable encapsulant

A semiconductor device includes a semiconductor die having a main surface, a rear surface, outer edge sides extending between the main and rear surfaces, and a first conductive bond pad disposed on the main surface, an electrically insulating mold compound body formed around the outer edge sides of the semiconductor die with the main surface of the semiconductor die exposed from an upper surface of the mold compound body, a first metallization layer formed on the upper surface of the mold compound body and on the main surface of the semiconductor die, and a first bond pad extension formed in the first metallization layer. The first bond pad extension overlaps with the upper surface of the mold compound body. The first bond pad extension is conductively connected with the first conductive bond pad. The first bond pad extension is an externally accessible point of electrical contact of the device.

Semiconductor device with bond pad extensions formed on molded appendage

A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.

Semiconductor package with plateable encapsulant and a method for manufacturing the same

Growing community of inventors

Malacca, Malaysia

Guan Choon Matthew Nelson Tee