Dupont Electronics, Inc.

Rohm & Haas Electronic Materials LLC

Grzegorz Slawinski

Joseph Casey Johnson

Husnu Alp Alidedeoglu

Thomas Edward Carney

Christopher Dennis Simone

Jaclyn Murphy

Michael Thomas Kwasny

Catherine Mulzer

Laila MacLaughlin

Patricia Gumbley

Cecilia Hall

Lin Ju

Benjamin Naab

In a first aspect, a metal-clad polymer film includes a polymer film adhered to a first metal layer. The root-mean-square roughness (S) of the interface between the polymer film and the first metal layer is less than 1 μm. The peel strength between the polymer film and the first metal layer is greater than 5 N/cm after 168 hours of aging at 150° C. when tested for a polymer film having a thickness in the range of from 25 to 75 μm and a first metal layer having a thickness of 18 μm in accordance with IPC-TM-650 test methods. The thickness of the first metal layer is 12 μm or less. The polymer film includes a first thermoplastic polyimide layer. In a second aspect, an electronic device includes the metal-clad polymer film of the first aspect. In a third aspect a process includes for forming a double-sided metal-clad polymer film.

Metal-clad polymer films and electronic devices

In a first aspect, a single layer polymer film includes 60 to 99 wt % of a crosslinked polyimide, having a gel fraction in the range of from 20 to 100% and a refractive index of 1.74 or less, and 1 to 40 wt % of a colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (S) of 6 &#x3bc;m or more, an L* color of 30 or less and a 60&#xb0; gloss of 15 or less. In a second aspect, a coverlay for a printed circuit board includes the single layer polymer film of the first aspect. In third and fourth aspects, processes are disclosed for forming a single layer polymer film including a crosslinked polyimide film including a dianhydride and a diamine.

Single layer polymer films and electronic devices

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Fairborn, OH, United States of America

Grzegorz Slawinski