Picarro, Inc.

Bookham Technology Limited

Northern Telecom Limited

Grzegorz Pakulski

Chris W Rella

Barbara A Paldus

Jinchun Xie

Serguei Koulikov

Eric R Crosson

Bruce A Richman

Alexander Katchanov

Robert Lodenkamper

Cornelis Blaauw

David M Adams

Agnes Margittai

D Gordon Knight

Richard J Finlay

Ronald Moore

A tunable laser and laser tuning method, based on the interaction of a spectrally dependent beam distortion and a spatial filter within a laser cavity. One embodiment of this laser is an external cavity semiconductor laser in which broad tunability is obtained by the insertion of an acousto-optic tunable filter (AOTF) into the laser cavity such that the intra-cavity laser beam passes through the AOTF in zeroth order.

Laser tuning by spectrally dependent spatial filtering

A laser tuning mechanism which embodies 'spectrally dependent spatial filtering' (SDSF) and contemplates two key elements of the tuning mechanism. The first element of the SDSF tuning mechanism is a spectrally dependent beam distortion (i.e. alteration of the amplitude and/or phase profile of the beam) provided by an SDSF tuning element in a laser cavity. The second element of the SDSF tuning mechanism is an intracavity spatial filter which makes the round trip cavity loss a sensitive function of both beam distortion and cavity alignment. Such a laser can be aligned so that a specific beam distortion, which is provided by the SDSF tuning element at a tunable wavelength, is required to obtain minimum round trip cavity loss, thereby providing tunable laser emission. A preferred embodiment of the SDSF tuning mechanism is an external cavity semiconductor laser having a zeroth order acousto-optic tuning element.

Laser Tuning by spectrally dependent spatial filtering

A semiconductor device such as a buried heterostructure semiconductor laser includes a semiconductor substrate supporting an active region comprised of a multiple quantum well active region and confinement layers having defined gratings and grating overgrowth regions to produce a laser device. The device also includes a current confinement layer including a sequence of doped n-p-n-p semiconductor layers to produce a n-p-n-p blocking structure and a semi-insulating semiconductor material deposited over the n-p-n-p blocking structure.

Hybrid confinement layers of buried heterostructure semiconductor laser

According to the present invention, laser performance is improved by appropriately matching the spectral periods of various etalons within the laser cavity. A first embodiment of the invention is a discretely tunable external cavity semiconductor laser where a grid fixing etalon is present in the laser cavity, the grid fixing etalon free spectral range (FSR) is a whole number multiple of the laser cavity FSR, and the grid fixing etalon FSR is a whole number multiple of the chip etalon FSR. A second embodiment of the invention is a fixed wavelength external cavity semiconductor laser where the chip etalon FSR is a whole number multiple of the laser cavity FSR, and a mode suppressing etalon is inserted into the laser cavity such that the mode suppressing etalon FSR is a whole number multiple of the chip etalon FSR. A third embodiment of the invention is a tunable external cavity semiconductor laser where the chip etalon FSR is a whole number multiple of the laser cavity FSR. A fourth embodiment of the invention is a fixed wavelength external cavity semiconductor laser where the chip etalon FSR is a whole number multiple of the laser cavity FSR.

Laser with reduced parasitic etalon effects

An improved method for etching a pattern in a semiconductor material is based on the formation of an InP grating mask on the semiconductor material. The formation of the InP grating mask involves the formation of a multi-layered structure on the semiconductor material with an etch-stop layer between two InP layers. A photoresist grating mask corresponding to the pattern to be etched in the semiconductor material is then formed on the top InP layer. Subsequently, a non-selective etch is used to penetrate the top InP layer, the etch-stop layer, and the lower InP layer. A suitable stripping solvent is then used to remove the photoresist followed by a selective etch to clear the remaining exposed InP material, remove contaminated material and to expose the underlying semiconductor material in accordance with the pattern to be etched. Additional masking beyond the InP mask is, therefore, not required. The exposed semiconductor material is then etched such that the pattern is transferred to the semiconductor material.

Method of etching patterns into epitaxial material

A method of accurately controlling the depth of etched gratings in uniform or layered quaternary III-V material. A native oxide is selectively grown on the area of the quaternary to be patterned and this native oxide is subsequently removed to engrave the surface. Periodic repetition of the oxide growth/removal steps results in gratings of the desired depths.

Method of etching patterns in III-V material with accurate depth control

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Woodlawn, Canada

Grzegorz Pakulski