Infineon Technologies Ag

Qimonda Ag

Grit Sommer

Florian Binder

Thorsten Meyer

Alfred Martin

Barbara Hasler

Stephan Dertinger

Bernd Waidhas

Markus Brunnbauer

Manfred Schneegans

Thomas Wagner

Thomas Peter Haneder

Holger Torwesten

Ralf Plieninger

Judith Lehmann

A semiconductor device is disclosed. One embodiment provides a semiconductor chip. The semiconductor chip includes a first electrode of a capacitor. An insulating layer is arranged on top of the first electrode. A second electrode of the capacitor is applied over the insulating layer, wherein the second electrode is made of a conductive layer arranged over the semiconductor chip.

Semiconductor device

A module includes a semiconductor chip and a conductive layer arranged over the semiconductor chip. The module also includes a spacer structure arranged to deflect the conductive layer away from the semiconductor chip.

Semiconductor module having deflecting conductive layer over a spacer structure

An integrated circuit having a semiconductor substrate with a barrier layer is disclosed. The arrangement includes a semiconductor substrate and a metallic element. A carbon-based barrier layer is disposed between the semiconductor substrate and the metallic element.

Integrated circuit having a semiconductor substrate with barrier layer

A semiconductor component includes a semiconductor chip, and a passive component, with the semiconductor component including a coil as the passive component. The semiconductor chip and the passive component are embedded in a plastic encapsulation compound with connection elements to external contacts.

Semiconductor component including a semiconductor chip and a passive component

A substrate has at least one feedthrough with at least one channel from a first main surface of the substrate to a second main surface of the substrate. The at least one channel is closed off with a first material. The at least one closed-off channel is filled with an electrically conductive second material.

Substrate with feedthrough and method for producing the same

A substrate with first and second main surfaces includes at least one channel extending from the first main surface to the second main surface. The at least one channel includes a first cross-sectional area at a first location and a second cross-sectional area at a second location. An electrically conductive first material is disposed in the at least one channel.

Growing community of inventors

Grafing, Germany

Grit Sommer