Infineon Technologies Ag

Nan Ya Technology Corporation

Qimonda Ag

Grit Bonsdorf

Detlef Weber

Wolfgang Dickenscheid

Marco Lepper

Jens Hahn

Dirk Efferenn

Jens Bachmann

Chung-Hsin Lin

Uwe Kahler

Frank Pietzschmann

Goetz Springer

Wen-Bin Lin

Ole Bosholm

The present invention provides a manufacturing method for forming an integrated circuit device and to a corresponding integrated circuit device. The manufacturing method for forming an integrated circuit device comprises the steps of: forming a first level on a substrate; forming a second level above the first level; forming a cap layer on the second level which covers a first region of the level and leaves a second region uncovered; and simultaneously etching a first contact hole in the first region and a second contact hole in the second region such that the etching is selective to the cap layer in the second region and proceeds to a greater depth in the first region.

Manufacturing method for forming an integrated circuit device and corresponding integrated circuit device

A method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits includes the following steps: providing a substrate; providing a whisker-containing layer made of aluminum metal or an aluminum alloy on the substrate; back-etching and/or resputtering the whisker-containing layer such that the whiskers are essentially removed; and structuring the whisker-free layer into the lines.

Method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits

A surface of a semiconductor wafer is cleaned following a chemical mechanical polishing process. With the semiconductor wafer rotating continuously, an integrated process sequence is used to etch the surface, rinse the surface, and they dry the surface. The apparatus for cleaning the semiconductor wafer has a turntable in a process chamber for rotating the wafer, a feed for cleaning medium, and a return.

Process and device for cleaning a semiconductor wafer

Growing community of inventors

Dresden, Germany

Grit Bonsdorf