Lumileds LLC

Koninklijke Philips Corporation N.v.

Philips Lumileds Lighting Company LLC

Shin-etsu Chemical Co., Ltd.

Nikko Materials Company, Limited

Koninklijke Philips Electronics N.v.

Nichigo-morton Co., Ltd.

Philips Lumileds Lighting, LLC

Lumileds Lighting Company LLC

Grigoriy Basin

Paul Scott Martin

Brendan Jude Moran

Robert Scott West

Lex Alan Kosowsky

Emma Dohner

Stefano Schiaffino

Gerard Harbers

John Edward Epler

Stein Kuiper

April Dawn Schricker

Marcel Rene Bohmer

Kentaro Shimizu

Frans Hubert Konijn

Hideo Kageyama

Kim Kevin Mai

Willem Hendrik Smits

Mooi Guan Ng

Robert F M Hendriks

Noad Shapiro

Daniel Bernardo Roitman

Oleg Borisovich Shchekin

Daniel Alexander Steigerwald

Kenneth John Vampola

Alexander H Nickel

Jeffrey Dellert Kmetec

Aldegonda Lucia Weijers

Uwe Mackens

Jipu Lei

Kinya Kodama

Kazutoshi Iwata

Mikhail Fouksman

Joost Peter Andre Vogels

Vernon K Wong

Chee Ming Thoe

Choon Earn Chan

Karl Adriaan Zijtveld

Ryoichi Yasumoto

Mari Holcomb

Phillip Barton

Salman Akram

Michael Ragan Krames

Frederic Stephane Diana

Mark Melvin Butterworth

Clarisse Mazuir

Gerd O Mueller

Regina B Mueller-Mach

Jerome Chandra Bhat

Norbertus Antonius Maria Sweegers

Rafael Ignacio Aldaz

Dmitri Simonian

Wouter Anthon Soer

Tewe Hiepke Heemstra

Willem Sillevis-Smitt

Han Ho Choi

Ashim Shatil Haque

Stefan Eberle

Marc Andre De Samber

Mukul Agrawal

Yasumasa Morita

R B Syivaram Balakrishnan

Thierry Maurice Francois De Smet

Anton Belyaev

Yi Shyan Goh

Dima Simonian

Tze-Sen Lim

Ching-hui Chen

Jing Liu

Joseph Chungchih Juan

LED eyewear

A converter layer bonding device, and methods of making and using the converter layer bonding device are disclosed. A converter layer bonding device as disclosed herein includes a release liner and an adhesive layer coating the release liner, the adhesive layer is solid and non-adhesive at room temperature, and is adhesive at an elevated temperature above room temperature.

Adhesive film transfer coating and use in the manufacture of light emitting devices

An inventive apparatus includes a substrate and a set of multiple electrically conductive traces. The substrate is transparent or reflective for visible light. The electrically conductive traces are sufficiently transparent, or are less than 200 μm wide and occupy less than 25% of an areal extent of the set, so as to enable visual observation of a scene through or reflected by the substrate along a sight line that passes through the set of electrically conductive traces.

Low-density electrical traces on a transparent or reflective substrate

A light emitting device includes an LED having a light emitting top surface and sidewalls. A phosphor structure is attached to the light emitting surface of the LED. The phosphor structure has a light emitting top surface facing away from the LED light emitting surface, and sidewalls. A light reflective material is arranged to cover the sidewalls of the LED and the phosphor structure. A light absorptive region is defined in the light reflective material around a perimeter of the light emitting surface of the phosphor structure. The light absorptive region may be spaced apart from the perimeter of the phosphor structure by a gap. The light absorptive region may be formed by ultraviolet laser illumination of the light reflecting material.

Light emitting device with high near-field contrast ratio

Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles or air voids. The pigments, light scattering particles, or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles, or air voids inhomogeneously distributed in the reflector. The side reflector can include phosphor particles.

Pigmented and scattering particles in side coating materials for LED applications

A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder laminated onto the porous glass or silicon support structure.

Converter with glass layers

A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder filling the porous glass or silicon support structure.

Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles and/or air voids. The pigments, light scattering particles and/or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles and/or air voids inhomogeneously distributed in the reflector. The side reflector may comprise phosphor particles.

Light emitting devices (LEDs) and methods of manufacturing LEDs are described. A method includes providing a layer of a wavelength converting material on a temporary tape. The wavelength converting material includes at least a binder or matrix material, particles of a non-luminescent material, and phosphor particles and has a concentration of 60%-90% by volume particles of the non-luminescent material and phosphor particles. The layer of the wavelength converting material is separated on the temporary tape to form multiple wavelength converting structures, which are provided on an array type frame. Heat and pressure are applied to the wavelength converting structures on the array type frame.

Phosphor converter structures for thin film packages and method of manufacture

A lighting structure according to embodiments of the invention includes a semiconductor light emitting device and a flat wavelength converting element attached to the semiconductor light emitting device. The flat wavelength converting element includes a wavelength converting layer for absorbing light emitted by the semiconductor light emitting device and emitting light of a different wavelength. The flat wavelength converting element further includes a transparent layer. The wavelength converting layer is formed on the transparent layer.

Wavelength converted light emitting device with small source size

A light emitting diode module comprising: at least one light emitting diode structure, an integrated reflector arrangement that comprises a reflector surface for reflecting light from a light emitting area of the light emitting diode structure. The integrated reflector arrangement further comprises a back reflection surface for diffusely reflecting light emitted via a side surface of the light emitting diode structure back to the light emitting diode structure. The back reflection surface is directly attached to at least a part of the side surface such that during operation of the light emitting diode module an emission of stray light by means of the side surface is reduced. The invention finally describes a flash module, an automotive front lighting or a projection light emitting diode system comprising at least one light emitting diode module.

LED module with high near field contrast ratio

A multi-stage lamination process is used to laminate a wavelength conversion film to a transparent substrate, and subsequently to a light emitting element. The wavelength conversion film may be an uncured phosphor-embedded silicone polymer, and the lamination process includes heating the polymer so that it adheres to the transparent substrate, but is not fully cured. The phosphor-laminated transparent substrate is sliced/diced and the wavelength conversion film of each diced substrate is placed upon each light emitting element. The semi-cured wavelength conversion film is then laminated to the light emitting element via heating, consequently curing the phosphor film. Throughout the process, no glue is used, and the optical losses associated with glue material are not introduced.

Glueless light emitting device with phosphor converter

Growing community of inventors

San Francisco, CA, United States of America

Grigoriy Basin