Pictos Technologies, Inc.

Dialog Semiconductor Gmbh

Gregory Urban

Ian Olsen

Randall M Chung

Sarit Neter

Magued M Bishay

James K Dawson

David Escobar

Mike Fukatsu

Edward Andrew Jakl

Richard Arthur Mann

Mitchell Reifel

The present invention is generally directed to methods and systems for distributing image capture devices, images, and prints. One embodiment of the present invention advantageously provides cameras, such as digital cameras or film cameras, to consumers for free or at a discounted cost. In exchange, the consumer makes a commitment that a certain number of image reproduction or prints will be purchased by the consumer and/or by others. In another embodiment, a user receives prints with associated advertisements attached at a reduced price.

Methods and systems for managing the distribution of image capture devices, images, and prints

A semiconductor component that receives incoming light includes an integrated circuit, a package and an optics unit. The optics unit may provide a pathway, either generally or selectively, for the incoming light to the photodetector circuitry of the integrated circuit and may modify the incoming light, as well. The optics unit may be either electrically active or passive. When active, the optics unit is coupled to the integrated circuit with a conductor. The optics unit may also include a liquid crystal device, a beamsplitter assembly, a lensing assembly or other filters, and/or apertures. The liquid crystal device can act as a shutter or a display and the optics unit may be a single module or a plurality of modules. The integrated circuit may also include shutter drive circuitry and image processing circuitry.

Integrated circuit optics assembly unit

The invention is an imaging device having a high fill factor. The high fill factor is achieved by constructing the light sensors in a vertical fashion in the imaging device. The control circuitry of the light sensor is then contained inside the integrated circuit chip, rather than taking up area that could otherwise be used for light collection. The majority of the area on the surface of the IC chip is made up of light sensing elements, since the control circuitry is embedded in the IC chip. The control circuitry is connected to the light sensing devices through vias in the IC chip. The control circuitry of the chip is mainly contained within the die, rather than on it.

Light sensing system with high pixel fill factor

Growing community of inventors

Las Flores, CA, United States of America

Gregory Urban