Donnelly Corporation

Lakeshore Vision & Robotics, L.l.c.

Gregory T Caskey

Niall R Lynam

Bryant P Hichwa

Angelo E Ciccone

Rodney S Arendsen

An inspection system for inspecting circular parts of the present invention includes a light source, a camera, and a computer, which is in communication with the camera and has stored therein known good part profile data. The light source is for directing light onto the part to be inspected, with the camera generating profile signals in response to the light on the part. The computer receives the profile signals from the camera and assembles the profile signals into a height image of the part and, further, compares the height image with the known good part profile data to determine whether the part is acceptable or unacceptable.

System and method of three-dimensional inspection of circular parts

A elemental mirror for vehicles having a luminous reflectance of at least about 30% includes a substrate coated with a thin layer of elemental semiconductor having an index of refraction of at least 3 and an optical thickness of at least about 275 angstroms. Preferably, the elemental semiconductor coating is sputter coated silicon or germanium and a light absorbing coating is included therebehind. The mirror is spectrally nonselective with elemental semiconductor optical thicknesses of about 275 to 2400 angstroms on the front substrate surface. Spectrally selective mirrors are provided by adding an interference coating to the elemental semiconductor layer coating, preferably of a dielectric such as silicon dioxide or silicon nitride, on either the front or rear substrate surface, or by using a thicker, single elemental semiconductor layer. Instead of an absorbing coating behind the mirror, additional elemental semiconductor and dielectric thin layers may be included to reduce secondary reflections. The method includes coating the thin elemental semiconductor layer on flat glass and heating to harden the layer and make it more scratch resistant, or heating and bending the glass without destroying the reflective properties of the mirror. The thin interference layer, secondary reflection reducing layers, and/or light absorbing coating may be coated before or after heating and bending.

Elemental semiconductor mirror for vehicles and method for making same

A mirror having a high luminous reflectance of at least about 60% of incident light at the wavelength region of about 550 nanometers and being acromatic includes a substrate coated with a reflector comprising a multilayer thin film stack. The thin film stack comprises a first thin film layer of an elemental semiconductor which is closest to the first surface of the glass substrate and has a refractive index of greater than 3.0, a second thin film layer which is farthest from the first surface of the glass substrate, and a third thin film layer disposed between the first thin film layer and the second thin film layer, the third thin film layer having a refractive index between about 1.3 and 2.7, the second thin film layer having a refractive index greater than the third thin film layer. A light absorbing coating is included on at least one surface of the substrate and a layer of the reflector, the light absorbing coating absorbing light transmitted by the reflector coated substrate. The elemental semiconductor may comprise silicon or germanium. The light absorbing coating may comprise one of a paint, a lacquer, a tape, a ceramic, a hot melt plastic, a resinous plastic, a plastisol, or an epoxy material.

Elemental semiconductor mirror

An elemental mirror having a high luminous reflectance of at least about 60% of incident light at the wavelength region of about 550 nanometers and being acromatic includes a substrate coated with a reflector comprising a multilayer thin film stack. The thin film stack comprises a first thin film layer of an elemental semiconductor which is closest to the first surface of the glass substrate and has a refractive index of greater than 3.0, a second thin film layer which is farthest from the first surface of the glass substrate, and a third thin film layer disposed between the first thin film layer and the second thin film layer, the third thin film layer having a refractive index between about 1.3 and 2.7, the second thin film layer having a refractive index greater than the third thin film layer. A light absorbing coating is included on at least one surface of the substrate and a layer of the reflector, the light absorbing coating absorbing light transmitted by the reflector coated substrate. Alternately, the multilayer thin film stack may be coated on the second surface of the glass substrate with the light absorbing coating disposed on the reflector coated second surface of the glass substrate. The elemental semiconductor may comprise silicon or germanium. The light absorbing coating may comprise one of a paint, a lacquer, a tape, a ceramic, a hot melt plastic, a resinous plastic, a plastisol, or an epoxy material.

The present invention is directed toward reducing catastrophic sparking in various sputtering processes, and especially reactive DC magnetron sputtering processes. Nonsparking sputtering targets and methods for making such targets having regions of sputtering and nonsputtering are disclosed in both planar and cylindrical forms wherein various means for electrically insulating the nonsputtered regions of the target from the sputtering gas plasma are provided. The means for insulating includes covering the regions of nonsputtering with an electrically insulating material. Corresponding methods of eliminating or substantially reducing such sparking are disclosed whereby various nonsparking planar and cylindrical targets are utilized in conventional DC magnetron reactive sputtering processes. Alternately, or in combination with particular nonsparking targets, the present invention includes alterations to the sputtering chamber to alleviate such sparking. Furthermore, the present invention is also directed toward DC reactive magnetron sputtering of either a planar or a rotatable, cylindrical target containing silicon, wherein the target is sputtered in an atmosphere containing oxygen.

Spark eliminating sputtering target and method for using and making same

Elemental semiconductor mirror for vehicles

Method for making elemental semiconductor mirror for vehicles

A spectrally selective, glare-reducing mirror for vehicles which includes a substrate having a multi-layer coating on one side. The multi-layer coating includes a thin, transparent dielectric layer, preferably of titanium dioxide at a thickness of about 600-650 angstroms, and a very thin layer of metal, preferably of aluminum or silver, at a thickness of between about 25 and 150 angstroms. The dielectric layer is closest to a source of incident light to be reflected by the mirror. When applied to the rear surface of a transparent substrate such as glass, the metal layer may also be coated with light absorbing material such as paint for protection and reduction in unwanted reflections. In the preferred dielectric and metal thicknesses, a blue reflecting mirror results having a glare-reducing luminous reflectance between about 35% and 60%, while costs are reduced due to lesser required amounts of metal than in prior known mirrors.

Growing community of inventors

Holland, MI, United States of America

Gregory T Caskey