National Instruments Corporation

Gregory Stephen Gonzales

Ron Jay Barnett

Tamir E Moran

Right angle transition to circuit. A system includes a conductive plate, coaxial transmission line, a circuit, parallel to the conductive plate, and a right angle transition from the coaxial transmission line to the circuit. The transmission line includes a center pin protruding through a hole in the plate, an outer conductor formed by a conductive surface of the hole, and air dielectric between. The circuit includes a top conducting layer (TCL), ground plane with cutout, and an insulating substrate between the TCL and ground plane that abuts the pin. The transition includes the pin, a conductive element connecting the center pin to the TCL, the outer conductor, the air dielectric, the abutment of the substrate against the pin, and the cutout. The abutment and cutout minimize manufacturing variations regarding distance between the pin and the ground plane. The transition tunes out inductance introduced by bonding the pin to the TCL.

Right angle transition to circuit

A connector is disclosed. The connector includes a conductive housing. The conductive housing includes a wall region enclosing a space for receiving an adapter. The conductive housing also includes an annular end piece extending radially inward from a first end of the wall region and terminating the space. The annular end piece includes a flat annular surface, and a raised deformable annulus mounted on the flat annular surface. The raised deformable annulus is of a height such that an insertion of the adapter into the space deforms the raised deformable annulus to generate a physical contact connection between the flat annular surface and the adapter.

Use of crushable connector interface

In one embodiment, a high frequency module may include a substrate. The substrate may include a first surface and a second surface substantially opposite of the first surface. The high frequency module may include a component coupled to the second surface. A direct current may be provided to the component using the substrate. The high frequency module may include a core coupled to the second surface of the substrate. In some embodiments, the core may include at least one opening extending through the core. The component may be positioned in at least one of the openings. In some embodiments, the high frequency module may include a cover coupled to the core. The component may be positioned in at least one of the openings between the substrate and the cover.

High frequency high isolation multichip module hybrid package

Method of fabricating a crushable connector interface

A measurement apparatus is disclosed. The measurement apparatus includes a lid configured to be removably affixed to a case. The lid is formed from a substrate composed of a first material. An interior surface of the lid includes a surface coating of a second material. A raised seal is affixed to the substrate and extends beyond the interior surface in a direction orthogonal to the interior surface. The raised seal includes an elastic deformable layer adjacent to the substrate. The raised seal also includes a surface conforming layer configured such that, when the lid is affixed to the case, the surface conforming layer is adjacent to the case along a side opposite the elastic deformable layer. The surface conforming layer is composed of a material of a yield strength less than a normal force generated by fixation of the lid to the case.

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Sebastopol, CA, United States of America

Gregory Stephen Gonzales