International Business Machines Corporation

Gregory Scott Hopper

David L Edwards

Sushumna Iruvanti

Raed A Sherif

Gaetano Paolo Messina

Mark G Courtney

Charles Frederick Jones

Albert Joseph Fahey

Alfred Grill

Vishnubhai Vitthalbhai Patel

Bernard S Meyerson

Egidio E Marotta

Nanik Bakhru

The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.

Method for cooling of chips using blind holes with customized depth

Apparatus for cooling of chips using blind holes with customized depth

The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.

Method and apparatus for cooling of chips using a plurality of

Apparatus for cooling of chips using a plurality of customized thermally

Method for cooling of chips using a plurality of materials

The present invention relates generally to a new erosion/corrosion resistant diaphragm, and more particularly to an erosion/corrosion resistant diaphragm that can be used in an apparatus for cooling integrated circuit chips. An erosion/corrosion resistant coating can be provided on one side of a metallic foil that will be exposed to fluid impingement. And, a similar erosion/corrosion resistant coating can be provided on the opposite side of the metallic foil where the normal thermal cycling of the chip might damage the unprotected metallic foil.

Erosion/corrosion resistant diaphragm

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Fishkill, NY, United States of America

Gregory Scott Hopper