Applied Materials, Inc.

Gregory S Verdict

Brian Hayes Burrows

Joseph Arthur Kraus

Kenneth E Pfeiffer

In a first aspect, a system includes (1) a chamber; (2) a variable speed vacuum pump coupled to the chamber; and (3) a pressure controller coupled to the chamber. The pressure controller compares a set point pressure with a pressure measurement for the chamber and adjusts a flow of gas through the pressure controller based on a difference between the pressure measurement and the set point pressure. The system includes a pressure measurement device coupled to the chamber and to the pressure controller, and a main controller coupled to the variable speed vacuum pump, the pressure controller and the pressure measurement device. The pressure measurement device measures a pressure within the chamber and provides a pressure measurement to the pressure controller and the main controller. The main controller (1) adjusts a speed of the variable speed vacuum pump; and (2) provides the set point pressure to the pressure controller.

Methods and apparatus for maintaining a pressure within an environmentally controlled chamber

A wafer transfer cassette of the kind which includes a support frame, a first wafer supporting construction, and a second wafer supporting construction. The support frame includes first and second vertically extending support structures which are horizontally spaced from one another. The first wafer supporting construction includes a first bracket portion and a first fin portion extending from the first bracket portion. The first bracket portion is mounted to the first support structure in a position wherein the first fin portion extends from the first bracket portion towards the second support structure. The second wafer supporting construction includes a second bracket portion and a second fin portion extending from the second bracket portion. The second bracket portion is mounted to the second support structure in a position wherein the second fin portion extends from the second support structure towards the first support structure. The first and second fin portions have upper surfaces positioned relative to one another to jointly support a wafer in substantially a horizontal orientation.

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Austin, TX, United States of America

Gregory S Verdict