Raytheon Company

Gregory S Renaud

Kenneth P Walsh, Jr

Derek B Wells

Dennis W Mercier

Dimitry Zarkh

Sarah L Palmer

Steven P Kemp

Gary E Marcelynas

Jr Kenneth P Walsh

Kenneth P Walsh Jr

An apparatus is disclosed comprising: a chassis including an array plate, the array plate having a plurality of first openings formed thereon; a plurality of floating inserts, each of the floating inserts being disposed in a different one of the first openings; a main board having a plurality of second openings formed thereon, the main board being coupled to the array plate via a plurality of alignment pins, each of the alignment pins extending through a respective one of the plurality of floating inserts and into a respective one of the plurality of second openings; and an electronic module coupled to the main board, the electronic module including a first connector and at least one alignment socket, the first connector being coupled to a second connector that is disposed on the main board, the alignment socket being arranged to receive a given one of the alignment pins.

Methodology for blindmating and cooling electronic modules

A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component (e.g., capacitor) of an electronics assembly, and a radial retention component supported about an inner surface (e.g., annular groove) of the opening of the collar body. The radial retention component (e.g., elastomeric O-ring) is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board. Associated systems and methods are provided.

Low profile, nesting capacitor collars

A passive locking mechanism for a telescoping structure includes a stud fixed to a first panel section, a lower pawl coupled to a second panel section, an upper pawl coupled to the second panel section operable to engage the lower pawl, and a lock wedge coupled to a third panel section. The lock wedge is operable to engage the upper and lower pawls. In a retracted position of the telescoping structure, the lower pawl is engaged with the lock wedge, such that the second panel section is locked in place relative to the third panel section, and the first panel section is free to move relative to the second panel section.

Sequencing locking mechanism for telescoging structures

Growing community of inventors

Dracut, MA, United States of America

Gregory S Renaud