Nacom Industries, Inc.

Orc Technologies, Inc.

The Perkin-elmer Corporation

Optical Radiation Corporation

Gregory R Baxter

Victor M Jacobo

Peter R Southworth

James H Beauchene

Eugene J Melbon

Glenn Rivard

William J Pappas

Jeffrey Tesone

An apparatus and method for double-sided imaging of a plurality of photoresist-coated substrates is provided. The apparatus includes a first and second substrate holder comprising at least three extendable chucks, each adapted to hold the substrate. The first substrate holder is mounted about a first axis and the second substrate holder is mounted about a second axis such that the at least three chucks are capable of rotation about the first axis between at least a first, second and third chuck positions. A first transfer arm is disposed adjacent the first substrate holder and adapted to transfer the substrate to a chuck of the first substrate holder when the chuck is in the first chuck position. A first mask is positioned adjacent the chuck in the second chuck position of the first substrate holder. A second mask is provided adjacent the chuck in the second chuck position of the second substrate holder. At least one radiation source is provided for emitting radiation through the first and second masks toward the chucks in the second chuck position of each of the first and second substrate holders. A second transfer arm adjacent the second substrate holder and adapted to transfer a substrate from the third chuck position of the second substrate holder.

Apparatus and method for exposing substrates

An apparatus and method for the proximity photolithography of large substrates is provided. The apparatus includes a mask frame for holding the mask in a substantially vertical position. A tiltable platen is provided for receiving a photoresist-coated substrate in a horizontal position. The platen includes a vacuum chuck for holding the substrate to the platen. The platen is tilted in order to place the substrate in a position parallel to the mask. A motor is used to move the mask into close proximity with the substrate and a scanning exposure is begun. The scanning exposure is accomplished by a rail-mounted shuttle which holds equipment for producing a collimated light beam. A servo motor drives the shuttle along the rail to perform the scanning exposure. Once the exposure is completed, the mask is moved away from the exposed substrate and the platen is lowered to its horizontal position. The vacuum chuck disengages the exposed substrate which is then transported from the platen. The platen can then receive a second substrate for exposure and the procedure can be repeated until a particular lot of substrates has been exposed.

A double-sided exposure apparatus with an optical registration system accurately aligns and prints a circuit pattern on both sides of a workpiece, such as a circuit board. The apparatus has a computer system in which setup parameters are entered to set the desired size of the board and accuracy of alignment. A control program of the computer directs a machine vision system to inspect the workpiece and pattern, and computes precision movements of the workpiece which compensate for any sag or other variations in the glass or board that change between off-contact and soft contact. The computer system uses fiducials on the two artworks and target holes on each board to align an artwork and the board prior to exposure. At least one inspection of the fiducials, and realignment of the workpiece, is performed after the pattern is in contact with the workpiece, to thereby compensate for workpiece warpage, variations, and sag or variations of the artwork holders. Alignment uses video cameras to detect the centers of the fiducials and target using a 'best-fit' data processing method, which method includes compensation for any sag in the glass artwork holders.

Double-sided circuit board exposure machine and method with optical

Apparatus for automatically transferring a cassette of semiconductor wafers from one 'clean' room to a second 'clean' room across an area that may be less clean. The system includes an elevator in each room where a load is manually positioned in a load stall, and is then withdrawn automatically to an elevator and moved to a different elevation and transferred to an enclosed horizontal conveyor at that elevation which spans the distance between the 'clean' rooms. The load then moves on a driven cart which straddles, and is magnetically coupled to an enclosed driver cart. The conveyor and the elevator stations are pressurized with clean air to maintain the necessary cleanliness for the wafer processing operation.

Conveyor system

A system is described for the automated transfer of wafer carriers containing semi-conductor wafers, to various work stations and processing units along a process line. The system includes tunnel and track segments which are joined to provide a path of desired length. A semi-conductor carrier rides on a cart, which is in one tunnel and is magnetically coupled to a motorized cart which is in a separate tunnel to keep contaminants away from the wafer carrier. The tunnel enclosing the wafer carrier is also purged with nitrogen or filtered air to keep contaminants away from the carrier.

Semiconductor wafer transport system

A hand-held spray gun comprises a pistol grip handle and a trigger that can be squeezed toward the pistol grip for actuating a poppet valve in the spray gun body to discharge fluid through a nozzle in the end of the spray gun. The poppet valve extends axially through a supply chamber which receives fluid passing to it through the interior of the pistol grip which, in turn, is connected to the source of the fluid, such as a liquid or gas. The supply chamber is sealed from a larger dispensing chamber through a seal carried on the poppet valve. The dispensing chamber communicates with long, narrow discharge passages in the nozzle end of the spray gun. The end of the poppet valve is enlarged to form a valve guide that slides back and forth in a valve guide cavity in the nozzle. A return spring in the cavity is biased against the face of the valve guide. The valve guide is sealed to the cavity to isolate the return spring from the fluid in the dispensing chamber. When the trigger is squeezed, it forces the poppet valve to move in the chamber to force fluid into the dispensing chamber to, in turn, force the fluid out through the discharge passages. This movement of the poppet valve also causes the valve guide to move against the bias of the return spring. When pressure is released from the trigger, the return spring forces the valve guide and poppet valve back to the normal position. There is no contact between the fluid and any parts of the spray gun other than parts made of chemically inert materials. The return spring, being made of metal, is isolated from the fluid to eliminate any contamination from possible chemical reactions.

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Orange, CA, United States of America

Gregory R Baxter