Micron Technology Incorporated

Lsi Corporation

Gregory P Shogan

Ananda C S Mahesh

John Maynard Dunham

Radhakrishna Togare

The present disclosure includes apparatuses comprising replaceable memory. An example apparatus may include a controller and a memory package coupled to the controller and including a plurality of memory dies. At least one of the memory package and the controller may be a replaceable unit that is removable from the apparatus and replaceable with a different replaceable unit while maintaining operation of the apparatus.

Replaceable memory

An AC/DC power supply, a method of delivering DC power at multiple voltages and a computer data storage system. In one embodiment the AC/DC power supply includes: (1) a transformer having a primary winding couplable to an AC power source and a secondary winding inductively couplable to the primary winding and (2) multiple DC voltage rails coupled to the secondary winding at designated locations and configured to deliver power to loads coupled thereto, each of the DC voltage rails configured to dynamically transfer therebetween an available portion of the power in response to changes in the loads.

AC/DC power supply, a method of delivering DC power at multiple voltages and a computer data storage system employing the power supply or the method

Thermal control through a channel structure is disclosed. In one embodiment, an apparatus includes devices operable at an undesired temperature relative to a desired operating temperature, a vented cover of each of devices, and a channel structure formed along a side face of each of the devices, the channel structure having any number of ridges to transfer a gas between the vented cover and an external location to the apparatus. The gas may modify an operating state of the devices from the undesired temperature to the desired operating temperature. A heat structure coupled to the vented cover and the side face may absorb a portion of an energy dissipated by at least one of the devices. A printed circuit board may be formed along an opposite face relative to the vented cover to enable the gas to escape to the external location through a cavity of the apparatus.

Growing community of inventors

Round Rock, TX, United States of America

Gregory P Shogan