Raytheon Company

US Government As Represented by the Secretary of the Army

Gregory P Schaefer

David H Altman

Travis L Mayberry

Kerrin A Rummel

Darin J Sharar

Kevin W Chen

Robert K Dodds

Michael L Andersen

Philip M Henault

Brandon H Allen

David B Brandt

David W Chu

Alicia G Allen

Daniel J Weissman

Christopher H Peters

An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.

Shape memory thermal capacitor and methods for same

A manifold structure and method of forming a structure having at least one enclosed cavity includes using an ultrasonic additive manufacturing (UAM) process to build up a solid component, forming a cavity in the solid component, filling the cavity with a sacrificial material, using a UAM process to build up a finstock layer over the cavity filled with the powder material to enclose the cavity and form the enclosed cavity, and removing the sacrificial material from the enclosed cavity after the finstock layer is ultrasonically welded to the solid component. The sacrificial material has an adequate density to support the UAM process of forming the finstock layer over the cavity and the material may be removed from the enclosed cavity, resulting in an enclosed cavity having smooth surfaces with an optimal fluid flow area therethrough.

Powdered metal as a sacrificial material for ultrasonic additive manufacturing

A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process.

Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels

A self-contained cooling system for a phased array antenna includes a cooling structure, a heat exchanger, and a pump for circulating a fluid coolant around a coolant loop. The cooling system receives power from a remote power source. The cooling structure includes a plurality of coolant inlet pipes, a plurality of coolant outlet pipes, and a plurality of cooling platforms. Each of the cooling platforms has a coolant channel that begins at one of the plurality of coolant inlet pipes, terminates at one of the plurality of coolant outlet pipes, and provides a flow path for a fluid coolant. The cooling structure further includes at least one base plate releasably mounted to at least one of the plurality of cooling platforms. One or more antenna elements associated with the phased array antenna are mounted on the base plate releasably mounted to at least one of the plurality of cooling platforms. The flow of the fluid coolant through the coolant channel dissipates thermal energy produced by the one or more antenna elements.

Remote cooling of a phased array antenna

Growing community of inventors

McKinney, TX, United States of America

Gregory P Schaefer