Google Inc.

Exaflop LLC

Gregory P Imwalle

David W Stiver

Emad Samadiani

Andrew B Carlson

Eehern J Wong

Christopher Gregory Malone

Soheil Farshchian

Thomas R Kowalski

Andrew J Schran

Thomas Chris Newcomb

Madhusudan K Iyengar

William Riis Hamburgen

Jimmy Clidaras

Jeremy Rice

Winnie Leung

Jonathan Beck

Melanie Beauchemin

Amir Meir Michael

Jerry Chiu

Madhu Krishnan Iyengar

Steven T Y Chow

Shawn Lewis

Abolfazl Sadeghpour

While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages

An apparatus for monitoring and maintaining thermal exhaust temperatures for monitored servers may include a processor in communication with an exhaust temperature control system. The processor may implement various control loops to monitor inlet and exhaust temperatures for one or more servers, and the processor may monitor temperatures of various hardware components within those one or more servers. When the processor determines that a hardware component for a given server is overheating, the processor may take steps to decrease the temperature of the overheating hardware component for the given server. To determine whether a hardware component is overheating, the processor may leverage the hardware component's operating temperature margin.

Dynamic server-level thermal control based on component temperatures

A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.

Cooling electronic devices in a data center

A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; a vapor chamber mounted on and in conductive thermal contact with the at least one heat generating processor device, the vapor chamber including a housing that defines an inner volume and encloses a working fluid; and a liquid cold plate assembly that includes a top portion mounted to at least one of the vapor chamber or the motherboard assembly and including a heat transfer member that includes an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member and formed on a top surface of the housing of the vapor chamber.

A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.

Method for adjusting cooling device based on battery presence

A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and a plurality of electronic heat-generating devices at least partially immersed in the liquid phase of the non-conductive coolant to transfer a heat load to the non-conductive coolant.

Dynamic server-level thermal control using inlet and exhaust temperatures

Techniques for cooling a data center include circulating a first cooling medium to cool a plurality of rack-mounted computers; circulating a second cooling medium to cool the plurality of rack-mounted computers; determining that a first portion of the plurality of rack-mounted computers is operating at a power usage above a threshold power usage; adjusting at least one of a flow rate of the first or second cooling mediums to cool a second portion of the plurality of rack-mounted computers; and rerouting a portion at least one the first or second cooling mediums to cool the first portion of the plurality of rack-mounted computers.

Cooling a data center

A system includes a first computing component and a second computing component. A first measurement indicative of a temperature of a first computing component is received. A second measurement indicative of a temperature of a second computing component is received. A thermal value is calculated for the first computing component based on the first measurement and the second measurement. In response to determining that the calculated thermal value exceeds the threshold, an operational or physical parameter of the system is modified.

Data center thermal monitoring

A data center cooling system includes a cooling liquid supply conduit fluidly coupled between a cooling plant and an air-to-liquid heat exchanger positioned to receive a heated airflow from one or more racks. At least one rack supports a plurality of heat-generating electronic devices. The system further includes a cooling liquid return conduit fluidly coupled between the cooling plant and the air-to-liquid heat exchanger; and a heat transfer module thermally coupled to the cooling liquid supply and return conduits between the cooling plant and the air-to-liquid heat exchanger. The heat transfer module includes a cold side and a warm side, with the cold side thermally coupled to the cooling liquid supply conduit to transfer heat from a flow of a cooling liquid in the cooling liquid supply conduit to the warm side of the heat transfer module, and the warm side including a heat sink.

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Sunnyvale, CA, United States of America

Gregory P Imwalle