Sandia Corporation

National Technology & Engineering Solutions of Sandia, LLC

Massachusetts Institute of Technology

Vivint Solar, Inc.

Nielson Scientific, LLC

University of Illinois

Gregory Nolan Nielson

Murat Okandan

Jose Luis Cruz-Campa

Paul J Resnick

Anthony L Lentine

Vipin P Gupta

Michael Robert Watts

Carlos Anthony Sanchez

Jeffrey S Nelson

Peggy J Clews

William C Sweatt

George Barbastathis

Anna Tauke-Pedretti

Roger Lee Jungerman

Willard S MacDonald

Michael Hibbs

Eric Langlois

Benjamin John Anderson

Jeffrey Cederberg

Ralph W Young

Peter Thomas Rakich

Douglas Chandler Trotter

Michael Shaw

Philip T Krein

Mark W Wanlass

Paul Davids

Jeffrey P Koplow

Michael Baker

Paul Gilbert Clem

Alex Robinson

Dale L Huber

Gregory Robert Bogart

Brian Benjamin Johnson

Robert J Anderson

Judith Maria Lavin

Christopher Alan Apblett

Ronald S Goeke

Sean J Hearne

Bongsang Kim

Various three-dimensional devices that can be formed within the bulk of a semiconductor by photo-controlled selective etching are described herein. With more particularity, semiconductor devices that incorporate three-dimensional electrical vias, waveguides, or fluidic channels that are disposed within a semiconductor are described herein. In an exemplary embodiment, a three-dimensional interposer chip includes an electrical via, a waveguide, and a fluidic channel, wherein the via, the waveguide, and the fluidic channel are disposed within the body of a semiconductor element rather than being deposited on a surface. The three-dimensional interposer is usable to make electrical, optical, or fluidic connections between two or more devices.

Three-dimensional micro-electro-mechanical, microfluidic, and micro-optical systems

Various technologies are described herein pertaining to electrochemical etching of a semiconductor controlled by way of a laser that emits light with an energy below a bandgap energy of the semiconductor.

Three-dimensional semiconductor fabrication

Embodiments of the present disclosure are related to solar module mounting systems. A system may include an adhesion sheet configured to be secured to a roof of a structure via an adhesive. The system may further include at least one clamp configured for securing at least one solar module to the adhesion sheet.

Solar module mounting

A moldable photovoltaic module is provided. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.

Moldable photovoltaic solar cell module

Embodiments of the present disclosure are related to solar module mounting systems. A system may include an adhesion sheet configured to be secured to a roof of a structure via an adhesive. The system may further include at least one clamp configured for securing at least one solar module to the adhesion sheet. Other embodiments are related to methods of attaching one or more solar modules to a structure.

A method, system and apparatus including a device cell having a top side, a bottom side and opposing side walls. A passivation layer is formed along the top side, the bottom side and opposing side walls of the device cell. The passivation layer serves to passivate the device cell and facilitate carrier collection around the device cell. An anti-reflective layer is formed over the passivation layer and an optical layer is formed on the top side of the device cell. The optical layer reflects light within the device cell. The apparatus may further include a reflective layer formed along the bottom side of the device cell, the reflective layer to reflect light internally within the device cell.

High performance ultra-thin solar cell structures

A method is provided for making a molded photovoltaic module. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.

An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.

Flexible packaging for microelectronic devices

An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. The system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.

Spreading devices into a 2-D module layout

The present invention relates to a biological probe structure, as well as apparatuses, systems, and methods employing this structure. In particular embodiments, the structure includes a hermetically sealed unit configured to receive and transmit one or more optical signals. Furthermore, the structure can be implanted subcutaneously and interrogated externally. In this manner, a minimally invasive method can be employed to detect, treat, and/or assess the biological target. Additional methods and systems are also provided.

Optoelectronic system and apparatus for connection to biological systems

A photovoltaic module includes colorized reflective photovoltaic cells that act as pixels. The colorized reflective photovoltaic cells are arranged so that reflections from the photovoltaic cells or pixels visually combine into an image on the photovoltaic module. The colorized photovoltaic cell or pixel is composed of a set of 100 to 256 base color sub-pixel reflective segments or sub-pixels. The color of each pixel is determined by the combination of base color sub-pixels forming the pixel. As a result, each pixel can have a wide variety of colors using a set of base colors, which are created, from sub-pixel reflective segments having standard film thicknesses.

Reflective photovoltaics

A photovoltaic power generation system that includes a solar panel is described herein. The solar panel includes a photovoltaic sub-module, which includes a group of microsystem enabled photovoltaic cells. The group includes a first string of photovoltaic cells, a second string of photovoltaic cells, and a differing photovoltaic cell. Photovoltaic cells in the first string are electrically connected in series, and photovoltaic cells in the second string are electrically connected in series. Further, the first string of photovoltaic cells, the second string of photovoltaic cells, and the differing photovoltaic cell are electrically connected in parallel. Moreover, the differing photovoltaic cell is used as a bypass diode for the first string of photovoltaic cells and the second string of photovoltaic cells.

Photovoltaic power generation system with photovoltaic cells as bypass diodes

Growing community of inventors

Albuquerque, NM, United States of America

Gregory Nolan Nielson