Lockheed Martin Corporation

Lockheed Martin Corpora Tion

Gregory M Drexler

Kevin J Thorson

Roger J Karnopp

Gregory J Whaley

Rick C Stevens

Brian L Uhlhorn

Ryan L Nelson

Brian D Sutterfield

Melissa A Grette

A pigtail-less optical connector assembly is described that is capable of data rates as high as 10 GHz. The described optical connector assembly connects the optical fiber connector to an optical die element mounted in the connector assembly using optical fiber ribbon and an optical deflecting device. The optical fiber connector is slideable within the connector assembly and is resiliently biased toward a home position. The connector assembly is designed to allow the optical fiber ribbon to flex without damaging the fiber ribbon as the optical fiber connector slides.

Pigtail-less optical connector assembly

A flexible circuit assembly that includes a flexible circuit substrate. A spacer is attached to a first side surface of the substrate, and a die carrier is attached to the opposite side surface of the substrate. The die carrier includes one or more photonic die mounted thereon that face an opening formed through the substrate so that the photonic die transmits and/or receives optical signals through the opening. Wire bonds electrically connect the photonic die to an electrical pad on the first side surface of the substrate. The spacer helps to space the wire bonds from an optical connector that connects to the flexible circuit assembly, so that the wire bonds do not interfere with the mechanical connection between the flexible circuit assembly and the optical connector.

Flexible circuit assembly with wire bonding

A flexible circuit assembly that integrates a first fiber optic die, for example a transmitter die, and a second fiber optic die, for example a receiver die, on a single flexible circuit. Alignment holes and the multiple die are accurately placed on a single flexible circuit. The precise placement of the alignment holes and the fiber optic die facilitate micron alignment accuracy to a mechanical transfer (MT) connector. Fiber optic die circuitry is electrically connected to the first fiber optic die and second fiber optic die and connected to the flexible circuit.

Integrated optical receiver and optical transmitter on a single flexible circuit assembly

A die circuit assembly and method are described that integrates a first fiber optic die and a second fiber optic die into one assembly containing alignment features allowing for the accurate aligning of the fiber optic die to a fiber optic connector. The die circuit assembly can be attached to a flexible circuit in a manner to ensure the planarity of the fiber optic die is kept normal to the fiber optic connector. A method is also described where a plurality of the die circuit assemblies are formed from a single assembly.

Fiber optic die circuit assembly and method of making

A flexible circuit assembly is described that integrates a first fiber optic die, for example a transmitter die, a second fiber optic die, for example a receiver die, a trans-impedance amplifier die and a transmitter driver die on a single flexible circuit. Alignment holes and multiple die are accurately placed on a single flexible circuit. The precise placement of alignment holes and fiber optic die facilitate micron alignment accuracy to a fiber optic connector, preferably a mechanical transfer (MT) connector. A heat sink is provided that transfers heat from the trans-impedance amplifier die and the transmitter driver die and isolates the fiber optic die from the heat source. Circuitry for the first fiber optic die, second fiber optic die, impedance die, and driver die, including isolated grounding circuitry, is also integrated on the flexible circuit assembly.

Optical transceiver assembly with integrated amplifier and transmitter driver on a flexible circuit

An electronics component assembly for cooling high power density components including a fluid cooled module cover. In one embodiment, the electronics component assembly includes a module cover that is configured to make thermal contact with heat-generating electronic components of a module. The module cover includes an inlet, an outlet and at least one fluid passageway between the inlet and the outlet. The fluid passageway permits fluid to flow through the module cover, thereby allowing the module cover to act as a heat sink.

Fluid cooled electronics module cover

An optical fiber connector and a method of forming an optical fiber connector are described where the optical fiber connector has low eccentricity tolerance at each end of the connector. Optical interconnection can be made at both ends of the connector, with the low eccentricity tolerance at each end providing improved light transmission at each interconnection. The connector is formed by using two commercially available, off-the-shelf connector members. Each connector member has a first end with a low eccentricity tolerance and a second end that allows for a fiber optic cable termination. The two connectors are connected together back-to-back, so that the second ends face each other and the first ends are disposed at opposite ends of the connector. The size of the connector can also be easily adjusted to make it shorter or longer.

Optical fiber connector and method

A connector assembly that integrates an optical fiber connector with a fiber optic transceiver into one assembly. The optical fiber connector is provided with end float for optical connection to an optical back panel. Some components of the fiber optic transceiver are mounted on the optical fiber connector and float with the connector. Other components of the fiber optic transceiver are mounted in static positions on a circuit card assembly that is part of the connector assembly. A flexible circuit electrically connects the transceiver components mounted on the optical fiber connector with the static transceiver components. The connector assembly eliminates the use of a fiber pigtail, improves the ease of mounting and removal of the fiber optic transceiver from the host board, consolidates the transceiver circuitry into one assembly, and allows reduction of the host board footprint and/or provides additional space on the host board for mounting other components.

Fiber optic transceiver within a connector assembly

Embodiments of the present disclosure include devices, systems, and methods. For example, one device embodiment of a thermally conductive shelf for operation with a conduction-cooled electronic module includes an expandable member defining a fluid passage between a first end and a second end, where the expandable member includes a first outer surface to contact a first conduction-cooled electronic module, an inlet located at a first end to receive a conductive fluid, and an outlet located at the second end to exhaust the conductive fluid.

Thermally conductive shelf

In one example embodiment, an optical connector arrangement includes a coupler with a first part and a second part each having a first end to receive an optical fiber core and a second end that releasably couples the first part and the second part. An insert block having a connector face and an assembly face is included in each of the first part and the second part. The connector face has a lens assembly to optically couple the optical fiber core of the first part and the second part, and the assembly face has an axial passageway that terminates in the assembly face and aligns with the first end to receive an end portion of the optical fiber core.

Growing community of inventors

Minnetonka, MN, United States of America

Gregory M Drexler