Superconductor Technologies Inc.

Resonant, Inc.

Antone Wireless Corporation

Other

Gregory Lynton Hey-Shipton

Kurt F Raihn

Sean McHugh

Roger J Forse

Michael M Eddy

George L Matthaei

Stephan M Rohlfing

Garrett Williams

Ashok Burton Tripathi

Andrew C Guyette

Wallace Y Kunimoto

James R Costa

Douglas Jachowski

Elna Saito

Michael J Scharen

Edward Robert Soares

Stacey M Bilski

Matthew P Hernandez

David Joseph Kapolnek

David L Skoglund

Sunil Kapoor

Gena Marie Yates

Filter devices. A first chip includes a first interdigital transducer (IDT) of a first acoustic resonator formed on a surface of a first piezoelectric wafer having a first thickness, interleaved fingers of the first IDT disposed on a portion of the first piezoelectric wafer spanning a first cavity in a first base. A second chip includes a second IDT of a second acoustic resonator formed on a surface of a second piezoelectric wafer having a second thickness less than the first thickness, interleaved fingers of the second IDT disposed on a portion of the second piezoelectric wafer spanning a second cavity in a second base. A circuit card coupled to the first chip and the second chip includes at least one conductor for making an electrical connection between the first IDT and the second IDT.

Transversely-excited bulk acoustic resonator split ladder filter

Networks and filters are disclosed. A network includes a resonator that exhibits both a resonance and an anti-resonance and an inverter circuit connected in parallel with the resonator to form a composite resonator. An anti-resonant frequency of the composite resonator is different from the resonator's anti-resonant frequency.

Resonator circuit using an inverter to adjust anti-resonance frequency

Filter devices and methods of fabricating filter devices. A filter device includes a first chip and a second chip. The first chip has a first material stack and contains one or more series resonators of a ladder filter circuit. The second chip has a second material stack and contains one or more shunt resonators of the ladder filter circuit. The first material stack and the second material stack are different.

Split ladder acoustic wave filters

An acoustic filter comprises a piezoelectric layer; an acoustic resonator structure monolithically disposed on the piezoelectric layer, the acoustic resonator structure including an arrangement of planar interdigitated resonator fingers; and a lumped capacitive structure monolithically disposed on the piezoelectric layer and being electrically coupled to the acoustic resonator structure, the lumped capacitive structure including an arrangement of planar interdigitated capacitive fingers, each of at least one of the interdigitated capacitive fingers having an edge that is entirely continuous.

Acoustic wave filter with enhanced rejection

Bandpass filters and methods of designing bandpass filters are disclosed. A bandpass filter includes a plurality of series acoustic resonators connected in series between an input and an output, and a plurality of\ shunt acoustic resonators, each shunt acoustic resonator connected between a ground and one of the input, the output, and a junction between two of the plurality of series acoustic resonators. A first shunt resonator of the plurality of shunt resonators has a motional resonance frequency higher than and adjacent to an upper edge of a passband of the bandpass filter.

Surface acoustic wave filters with extracted poles

Multi-band filters, communications devices, and methods of designing multi-band filters are disclosed. A multi-band filter has a lower pass-band and an upper pass-band separated by an intervening stop-band. The multi-band filter includes a first ladder network and a second ladder network coupled in series. The first ladder network provides transmission zeros at frequencies below a lower edge of the lower pass-band and transmission zeros at frequencies above an upper edge of the upper pass-band. The second ladder network provides transmission zeros at frequencies within the intervening stop-band.

Dual passband radio frequency filter and communications device

Communications devices, triplexers, high-pass filters, and low-pass filters are disclosed. A communications device includes a triplexer having a common port and first, second, and third branch ports. A hybrid LC/SAW high-pass filter is connected between the common port and the third branch port, a hybrid LC/SAW low-pass filter is connected between the common port and an internal node, an LC high-pass filter is connected between the internal node and the second branch port, and an LC low-pass filter is connected between the internal node and the first branch port.

Radio frequency filter, high selectivity triplexer, and communications device

Multi-band filters and communications devices are disclosed. A multi-band filter has a lower pass-band and an upper pass-band separated by an intervening stop-band. The multi-band filter includes a first ladder network and a second ladder network coupled in series. The first ladder network is configured to provide transmission zeros at frequencies below a lower edge of the lower pass-band and transmission zeros at frequencies above an upper edge of the upper pass-band. The second ladder network is configured to provide transmission zeros at frequencies within the intervening stop-band.

A narrow-band acoustic filter comprises an input and an output, and at least one acoustic resonator pair coupled between the input and the output. Each of the acoustic resonator pair(s) comprises at least one in-line acoustic resonator and in-shunt acoustic resonator that operate together to create a nominal passband. The acoustic filter further comprises at least one capacitive element in parallel with one of the in-line acoustic resonator and the in-shunt acoustic resonator of each of the acoustic resonator pair(s), thereby sharpening one of a lower edge and an upper edge of the nominal passband.

A RF device such as a tower mounted amplifier (TMA), mast-head amplifier (MHA), or Tower Mounted Boosters (TMB) includes a housing having a plurality of cavities and an input and an output, the input being coupled to the antenna and the output being coupled to a base station. The housing includes a transmission path holding multiple coaxial resonators. The housing further includes multiple receive paths including at least one path having a plurality of cavities, each cavity containing a dielectric resonator. The metallic transmit resonator nearest the antenna input is coupled to the first dielectric resonator via a common resonant wire. The last dielectric resonator in the receive path is coupled to a first metallic resonator of a downstream clean-up filter via another common resonant wire.

Low noise figure radiofrequency device

Systems and methods for an upgradeable and/or reconfigurable receiver are provided. In general, the present invention is directed to providing systems and methods for designing an electronic communication system having easy and cost effective upgradeable receiver systems and components including, for example, an amplifier and/or a filter. For example, a receiver may include a receiver front end that is configured so that at least one of the original conventional system components may be used along with one or more new system components to provide greater receiver sensitivity and/or selectivity. In various embodiments, portions of an upgradeable receiver system may be made as modular components that allow easy replacement for the upgradeable components which may include a signal amplifier and/or a signal filter. In various embodiments the receiver may be upgraded by replacing a conventional low noise amplifier (LNA) with a high temperature superconductor (HTS) filter and/or a cryo-cooled LNA.

Systems and methods for receiver upgrade

A filter network designed for providing high frequency selectivity with a high degree of reliability and availability. The filter network comprises a superconducting filter and a non-superconducting filter, or a combination thereof to form multiplexers. A receive side of the non-superconducting filter pre-filters received RF signals before inputting them to the superconducting filter. The non-superconducting filter is constructed and arranged to pass RF signals having a frequency within a first pass band to the superconducting filter. The superconducting device is constructed and arranged to exhibit a high-degree of frequency selectivity in further narrowing the received RF signals. Other aspects are directed to the arrangement, construction, and uses of the same structures to accomplish different but similar goals. In a multiplexed configuration, various combinations of transmit filters are used to enable the use of a common antenna with the receive side electronics, which may be located at the top of the antenna tower or in the base station.

Filter network combining non-superconducting and superconducting filters

RF switches and methods of use are provided. In one embodiment, a RF switch includes first and second switch assemblies, each comprising an elongate member and a magnetic housing on an end of the member. The magnet is disposed between contact pads for first and second circuits, and an electromagnetic source is coupled to the assemblies. Each switch has a first and second state. Another RF switch of the present invention includes a rotor, an elongate member disposed centrally through the rotor, an actuator coupled to the member and configured to rotate the member and the rotor, and a contact on the rotor that may touch a substrate. The contact is used to complete a first path or a second path.

RF receiver switches

A HTS-based RF receiver includes a cryocooler and a cryogenic enclosure in thermal communication with the cryocooler. The cryogenic enclosure contains a HTS filter and a LNA therein. A first MEMS bypass switch is positioned between a RF input and the HTS filter, the first MEMS bypass switch operatively coupling the RF input to the HTS filter. A second MEMS bypass switch is positioned between the LNA and RF output, the second MEMS bypass switch operatively coupling the LNA to the RF output. A bypass pathway located within the cryogenic enclosure is connected between the first and second MEMS switches to bypass the HTS filter and LNA when an operating parameter of the RF receiver falls outside a pre-determined range.

Growing community of inventors

Santa Barbara, CA, United States of America

Gregory Lynton Hey-Shipton