Palo Alto Research Center Inc.

Cambridge Display Technology Limited

Panasonic Corporation

Xerox Corporation

University of Colorado

X Development LLC

Wing Aviation LLC

Gregory Lewis Whiting

Scott J H Limb

Ping Mei

Jengping Lu

Tse Nga Ng

Christopher L Chua

Janos Veres

Rene A Lujan

Sean Roark Garner

Robert Anthony Street

Eugene Michael Chow

Bing R Hsieh

Steven E Ready

Jonathan J Halls

Scott J Limb

Sadayoshi Hotta

Qian Wang

Brent Shawhan Krusor

James Ryan Burgess

Sanjiv Sambandan

Chirath Neranjena Thouppuarachchi

Craig Edward Murphy

Armin R Volkel

David Eric Schwartz

Jeremy H Burroughes

Joerg Martini

Ana Claudia Arias

Sylvia Joan Smullin

Sivkheng Kor

David Kalman Biegelsen

David Kirtland Fork

Patrick Yasuo Maeda

Timothy D Stowe

Jason Donald Thompson

Philipp Helmut Schmaelzle

Dirk De Bruyker

Norine E Chang

Nan-Xing Hu

Francisco Eduardo Torres

Biby Esther Abraham

Guiqin Song

Jeng Ping Lu

Euan Christopher Smith

John E Northrup

Anurag Ganguli

Christopher A Paulson

Ramkumar Abhishek

Michael I Recht

George Daniel

Sean Emerson Doris

Yunda Wang

Dirk DeBruyker

Yong Zhang

Jonathan Rivnay

Fatemeh Nazly Pirmoradi

JenPing Lu

Diana Torres Sanchez

Ichiro Fujieda

Kaname Ito

Rayshan Visvanathan

Gabrielle Marinick

Madhur Atreya

Disclosed are sensors and related methods for measuring enzyme activity in a measurement environment and for quantifying enzyme and/or microbe concentrations in the measurement environment. An enzyme activity sensor includes a degradable conductive trace and a biodegradable target configured to enable the conductive trace, in an initial state, to conduct electrical current between first and second terminal ends via conductive particles. The conductive trace is configured to degrade over time as a result of enzymatic activity that degrades the biodegradable target when the sensor is placed in a measurement environment, the enzymatic activity thereby increasing resistance between the first and second terminal ends.

Method to sense the presence and activity of microbes through the use of transient sensing materials

A self-destructing device includes a frangible substrate having at least one pre-weakened area. A heater is thermally coupled to the frangible substrate proximate to or at the pre-weakened area. When activated, the heater generates heat sufficient to initiate self-destruction of the frangible substrate by fractures that propagate from the pre-weakened area and cause the frangible substrate to break into many pieces.

Pre-conditioned self-destructing substrate

A method comprises printing a conductive ink on a substrate to form one or more electrodes and printing an electrode ink on one or more of the electrodes. The conductive and electrode inks are cured. Next, an enzyme ink layer is printed on at least one electrode, and the enzyme ink layer is cured with ultraviolet light. Each of the printing and curing processes are performed in an in-line process.

Method for immobilizing enzymes using ultraviolet curing

A method of forming a charge pattern on a microchip includes depositing a material on the surface of the microchip, and immersing the microchip in a fluid to develop charge in or on the material through interaction with the surrounding fluid.

Microchip charge patterning

A system and method are provided for implementing a unique scheme by which to execute digital vapor phase patterning on metals, semiconductor substrates and other surfaces using a proposed variable data digital lithographic image forming architecture or technique. For certain substrate printing and manufacturing applications, including some printed electronics applications, the disclosed schemes implement techniques to digitally pattern metal layers with bulk material properties in a manner that is aligned with underlying layers on the fly. The disclosed digital printing process may pattern a release oil on a substrate in support of a metal deposition process. Changeable patterning is implemented with an ability to modify the alignment of the patterns on-the-fly. The release layer on a drum is laser patterned in order that the patterned release layer is transferred to the substrate, or the patterning of the release layer is accomplished directly on the substrate.

Systems and methods for implementing digital vapor phase patterning using variable data digital lithographic printing techniques

Integrated circuit structures, arrangements, and manufacturing processes are discussed herein. In one example, a method of forming a transistor structure includes forming a dielectric layer onto a gate element and forming a corrugated surface into the dielectric layer using at least an atomic layer etching (ALE) process to remove portions of the dielectric layer. The method also includes forming a semiconductor layer onto the corrugated surface and forming a source element and a drain element onto the semiconductor layer.

Fabrication of corrugated gate dielectric structures using atomic layer etching

A stressed substrate for transient electronic systems (i.e., electronic systems that visually disappear when triggered to do so) that includes one or more stress-engineered layers that store potential energy in the form of a significant internal stress. An associated trigger mechanism is also provided that, when triggered, causes an initial fracture in the stressed substrate, whereby the fracture energy nearly instantaneously travels throughout the stressed substrate, causing the stressed substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. The internal stress is incorporated into the stressed substrate through strategies similar to glass tempering (for example through heat or chemical treatment), or by depositing thin-film layers with large amounts of stress. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.

Stressed substrates for transient electronic systems

Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.

Bare die integration with printed components on flexible substrate without laser cut

A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down. The frangible glass substrate is engineered such that a stress profile produced by the rapid heating/cooling of the localized region generates an initial fracture force that subsequently propagates throughout the glass substrate, whereby sufficient potential energy is released to powderize the electronic elements.

Self-limiting electrical triggering for initiating fracture of frangible glass

A self-destructing device includes a stressed substrate with a heater thermally coupled to the stressed substrate. The device includes a power source and trigger circuitry comprising a sensor and a switch. The sensor generates a trigger signal when exposed to a trigger stimulus. The switch couples the power source to the heater in response to the trigger signal When energized by the power source, the heater generates heat sufficient to initiate self-destruction of the stressed substrate.

Method of forming a photodiode

Pre-conditioned substrate

A method and system utilizes ink jetting or printing of surface work function modification material or solution to form modified p-type and/or n-type electrodes. The proposed method is suitable for making complementary OTFT circuits in roll-to-roll fabrication environment.

Selective surface modification of OTFT source/drain electrode by ink jetting F4TCNQ

A passive sensor tag system including a passive electronic sensor tag and an external readout. The passive electronic sensor tag including a sensor element configured to sense data in a local environment and to cause a shift in a fundamental electrical resonance frequency characteristic of a sensor circuit based on the sensed data. The external readout including an external readout circuit that is configured to generate a signal having a frequency and a voltage and to transmit the signal through an output antenna. The transmitted signal coupling the sensor circuit and the external readout circuit. The external readout determining a fundamental electrical resonance frequency characteristic of the sensor circuit based on the impedance of the coupled sensor circuit and external readout circuit. The external readout determining the sensed data based the fundamental electrical resonance frequency characteristic of the sensor circuit.

Passive sensor tag system

A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members. One-way crack propagation is achieved by providing a weaker member region only on the downstream side of each inter-structure bond.

Complex stress-engineered frangible structures

Apparatus and methods related to aviation communications are included. A computing device can receive position data indicating a position of an aerial vehicle. The position can include an altitude. The computing device can determine, from a plurality of possible airspace classifications, a first airspace classification at the position of the aerial vehicle, where each airspace classification specifies one or more communication parameters for communication within an associated airspace. The computing device can select, from a plurality of communication repositories, a first communication repository that is associated with the first airspace classification, where each communication repository specifies a set of pre-defined communication components for at least one associated airspace classification. The computing device can generate a communication related to the aerial vehicle using the first communication repository. The computing device can send the generated communication to at least one recipient.

Automated air traffic communications

Growing community of inventors

Menlo Park, CA, United States of America

Gregory Lewis Whiting