Delco Electronics Corporation

Gregory L Hall

John A Hearn

Mark E Webster

Dwight L Schwarz

Ronald D Myer

Steven A Middleton

Steven Michael Stansberry

Daniel R Bellus

A method is provided for wire bonding an aluminum wire to a surface of a lead of an electronics package. The method entails a nickel plating process and an ultrasonic bonding process which together cooperate to form a reliable and highly repeatable joint between the wire and the lead member. The ultrasonic bonding process is specifically tailored to the nickel plating produced by the plating process, so as to significantly enhance the bond strength of the resulting ultrasonic bond joint. The plating process is devised to produce a nickel plating which is thicker than that generally practiced, and whose surface is characterized as having a relatively smooth microfinish which unexpectedly serves to enhance the bond strength of the ultrasonic bond joint.

Method for wire bonding an aluminum wire to a lead of an electronics

Disclosed is a high temperature, high pressure process of encapsulating electronic devices. The high pressure process is particularly suitable for encapsulating flip-chip devices wherein the collapse of flip-chip solder bumps is prevented. A special mold may be used to prevent the ceramic substrate of the flip-chip device from breaking under the high injection pressure conditions. The encapsulant is a rigid liquid crystal polymer.

Liquid crystal polymer encapsulated electronic devices and methods of

Disclosed is a wirebond pin having a star-shaped anchor, collar and paddle. The collar prevents passivation material, used to make a sealed semiconductor device, from leaking out of the package. The collar also helps to eliminate the resonant vibration of the pin during ultrasonic wirebonding at the paddle.

Wirebond pin-plastic header combination and methods of making and using

Growing community of inventors

Azle, TX, United States of America

Gregory L Hall