The Boeing Company

Gregory Kim

Kevin Nemeth

Jimmy P Huynh

Michael A Whelan

Thomas Rust, Iii

Jonathan M Allison

Creed Reilly

Thomas Rust Iii

Example implementations relate to techniques for thermal fluid conditioning and delivery. A technique may involve coupling a container of heat transfer fluid to an input and removing moisture from the heat transfer fluid via a molecular sieve. A pressure source is configured to push the heat transfer fluid out of the container and through the molecular sieve. Subsequent to removing the moisture from the heat transfer fluid, the technique involves separating, via an orifice coupled to a tank, the heat transfer fluid into liquid and gas particles within the tank and removing, via a vacuum coupled to the tank, the gas particles from the tank. The liquid can then be supplied into a fluid system via additional pressure by the pressure source. The technique may be performed by a portable device that houses the various components used to condition and delivery the thermal fluid.

Methods and systems for thermal fluid conditioning and delivery

The present application relates to systems, methods, and apparatus for facilitating the testing of a payload. An exemplary apparatus may include a fluid inlet port configured to receive fluid from a thermal subsystem of the payload. The apparatus may also include an actuating device configure to supply the fluid to a heat exchanger. A valve may be configured to receive the fluid from the heat exchanger and separate the fluid into a first fluid line and a second fluid line. A first fluid outlet port may be configured to supply the fluid to the thermal subsystem of the payload and a second fluid outlet port may be configured to supply the fluid to the thermal subsystem of payload.

Integrated phased array (IPA) thermal subsystem fluid loop simulator

In one aspect a satellite comprises a body, a solid state power amplifier, a heat acquisition and transfer device positioned proximate at least one heat generating element on the solid state power amplifier, and a heat rejection device in thermal communication with the heat acquisition and transfer device to reject heat acquired from the solid state power amplifier. Other aspects may be described.

System and method to remove heat from a power amplifier

Growing community of inventors

El Segundo, CA, United States of America

Gregory Kim