Teraconnect, Incorporated

Teraconnect, Incoporated

Gregory K Duddoff

John A Trezza

Richard J Williams

Ronald J Olson, Jr

An optical array chip ( ) is flip-chip bonded to ASIC substrate ( ), and electrically connected to its supporting circuitry through compressively joined solder bump sets ( ) and ( ). Flowable epoxy hardener material ( ) is applied to underfill between the surfaces of chip ( ) and the ASIC surface, surrounding the bump contact sets and filling a standoff cavity system that had been etched in the electrical interface side of chip ( ) to a depth greater than electrical layer ( ) of chip ( ) by the amount of the pre-determined standoff height, prior to application of its bump contacts. Standoff grid ( ) and individual optical devices ( ) are exposed after lapping and etching of the optical interface side of chip ( ) down to the level of electrical layer ( ). The grid structure may have other forms, such as a vertical perimeter standoff ridge surrounding chip ( ) or penetrating electrical layer ( ), or a distributed pattern of vertical posts or wall sections penetrating electrical layer (66).

Precision grid standoff for optical components on opto-electronic devices

This invention provides a method for making interdigitated optoelectronic devices in which the surfaces of the photonic devices, emitters and detectors, are protected from contaminants during processing through the use of multiple etch stop layers.

Method of making an optoelectronic device using multiple etch stop layers

A method for integration of integrated circuit devices includes providing an array of first devices including dummy devices on a first chip; providing an array of contacts on a second chip; flip-chip bonding the first device to the contacts; filing the voids between the two interstitially of the first devices with an underfill; masking the first devices leaving exposed selected dummy devices; removing the dummy devices leaving an array of holes with contacts; providing a spaced array of second devices on a third chip matching the array of holes; flip-chip bonding the second devices to the contacts in the holes; and filling the voids between the chips associated with second devices with an underfill.

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Amherst, NH, United States of America

Gregory K Duddoff