Lockheed Martin Corporation

Gregory George Romas, Jr

David Louis Hoelscher

Thomas Eugene Byrd

Jatin Nikul Mehta

Daniel Homiak

Em Hoang

Huan V Le

Brad Clinton Ortloff

Tyrel D Parks

Control circuits with energy recycling for envelope elimination and restoration and related methods are disclosed. A control circuit includes a filter module configured to condition an input power signal to provide an output power signal. An energy recapture module is electrically coupled to the filter module and is configured to capture a portion of residual energy from the filter module and return the portion of the residual energy to the input power signal. A control module is electrically coupled to the filter module and the energy recapture module and is configured to control the filter module to provide the output power signal and is further configured to control the energy recapture module to capture and return the portion of the residual energy to the input power signal.

Control circuits with energy recycling for envelope elimination and restoration and related methods

A bi-directional switch that includes a first terminal, a second terminal, and a plurality of ballast circuits is provided. Each ballast circuit includes a first metal-oxide-semiconductor field-effect transistor (MOSFET) comprising a first input connector, a first output connector, a first body, and a first body diode, and a second MOSFET comprising a second input connector, a second output connector, a second body, and a second body diode. Each first input connector is coupled to the first terminal, each second input connector is coupled to the second terminal, and each first output connector is coupled only to the second output connector of the second MOSFET that is in a same ballast circuit.

Bi-directional switch

Power modules with reduced parasitic inductances are provided. A power module includes a first substrate including a first electrically-conductive layer and a second substrate including a second electrically-conductive layer. These substrates may be stacked on each other. A scalable network of power switches may be arranged on the substrates. Power bars may be connectable to the electrically-conductive layers through electromechanical interfaces at selectable interface locations. The locations and/or type of interface may be selectable based on the arrangement of the switches. The first and second electrically-conductive layers may be disposed on mutually opposed surfaces of a dielectric layer having a thickness chosen to effect a level of coupling between respective source and return current paths provided by the electrically-conductive layers. The level of coupling may be arranged to increase the mutual inductance within the power module, which can effectively reduce the formation of parasitic inductance in the power module.

Power module having stacked substrates arranged to provide tightly-coupled source and return current paths

A multiport AC link converter includes a resonant AC link, an input port, an output port, and a plurality of switches. A first subset of the switches is between the input port the resonant link and a second subset of the switches is between the resonant link and the output port. The switch sequencing for the input port is selected and executed independently of the switch sequencing for the output port the switch sequencings for the output port is selected and executed independently of that for the input port.

Growing community of inventors

Coppell, TX, United States of America

Gregory George Romas, Jr