Velo3d, Inc.

Aeris Capital Sustainable IP Ltd.

Veo3d, Inc.

Gregory Ferguson Brown

Benyamin Buller

Peter Stone

Tasso Lappas

Rueben Joseph Mendelsberg

Kimon Symeonidis

Nina Cathryn Bordeaux

Erel Milshtein

Brian Charles Spink

David B Jackrel

Jacob Woodruff

Kristin Pollock

Katherine Dickey

Thomas B Brezoczky

Robert Michael Martinson

Richard Joseph Romano

Sergey Korepanov

Alexander Varlakhanov

Daniel Christiansen

Alex Brudny

Joseph Andrew Tralongo

Pieter Coulier

Jatinder Randhawa

Gustavo A Tapia Imbaquingo

Josiah Franklin Willard

Aqi He

Aram Yegiazaryan

Alexander Talalai

Anatolii Vitanov

Dean Albert Tarrant

The present disclosure provides three-dimensional (3D) printing systems, apparatuses, methods and non-transitory computer readable media for the production of at least one requested 3D object. The 3D printer described herein facilitates operation of a layer dispensing mechanism with high precision albeit operating in an enclosure contaminated by debris, e.g., during the 3D printing. The debris may be a byproduct of the 3D printing.

Three-dimensional printer components

Provided herein are methods, apparatuses, and non-transitory computer readable media concerning quality assurance of three-dimensional object(s) and their formation. In some embodiments, a plurality of variables is considered in assessing performance of a manufacturing mechanism (e.g., printer) utilized in forming the three-dimensional object(s). In some embodiments, a plurality of variables is considered in assessing a process for forming the three-dimensional object(s). In some embodiments, a plurality of variables is considered in assessing a quality of the formed three-dimensional object(s).

Quality assurance in formation of three-dimensional objects

The present disclosure provides three-dimensional (3D) printing methods, apparatuses, systems and/or software to form one or more three-dimensional objects, some of which may be complex. The three-dimensional objects may be formed by three-dimensional printing using one or more methodologies. In some embodiments, the three-dimensional object may comprise an overhang portion, such as a cavity ceiling, with diminished deformation and/or auxiliary support structures.

Three-dimensional printing of three-dimensional objects

Methods and devices are provided for forming multi-nary semiconductor. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Multi-nary group IB and VIA based semiconductor

Methods and devices are provided for forming multi-nary semiconductor. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy.

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San Jose, CA, United States of America

Gregory Ferguson Brown