Microelectronics and Computer Technology Corporation

Gregory E Pitts

Daniel M Andrews

Alexander J Russo

William Weigler

David E Boone

A multilayered electrical interconnect circuit whereby interconnect lines, placed in channel regions throughout a rerouting substrate, function to reroute densely packaged electrical components via geometrically uniform spot links placed upon only the surface layer within each channel region. The interconnect circuit has closely spaced parallel X-and Y-lines orthogonal to one another, each X- and Y-line placed within horizontal and vertical channel regions, respectively, such that electrical connections between closely spaced large-scale integrated circuits or discrete electrical components can be rerouted with a combination of one or more X- and/or Y-lines.

Reroute strategy for high density substrates

A method of replacing a defective electronic component having a plurality of electrical leads bonded to electrical contacts on a support by cutting leads adjacent the bond site, rebonding the stubs to the contacts, replacing the defective component and bonding the leads of the replacement component to the electrical contacts. Preferably, the leads are cut simultaneously with the rebonding of the stubs. The leads may be bonded to the top of the stub or to the side of the stub. A bonding tool is provided for simultaneously cutting a lead and rebonding the resultant stub.

Apparatus for replacing defective electronic components

Method for replacing defective electronic components

A single point bonding apparatus and method for bonding one electrical conductor to a second electrical conductor by a thermosonic process using force, time, temperature and ultrasonic energy as the key parameters in forming the bonds. A bonding tool has a tip with a multiple of nonparallel surfaces extending from the end of the tip for maximizing the amount of ultrasonic energy coupled to the electrical conductors. The surfaces may be recessed into the end of the tip or protrude outwardly from the end of the tip for coupling ultrasonic energy in directions both parallel and perpendicular to the conductors.

Growing community of inventors

Austin, TX, United States of America

Gregory E Pitts