Applied Materials, Inc.

Gregory E Menk

Jason Garcheung Fung

Rajeev Bajaj

Daniel Redfield

Fred Conrad Redeker

Nag B Patibandla

Mahendra Christopher Orilall

Gopalakrishna B Prabhu

Kasiraman Krishnan

Garlen C Leung

Robert E Davenport

Erik S Rondum

Aniruddh Jagdish Khanna

Russell Edward Perry

Peter McReynolds

Anand N Iyer

Mario Dagio Cornejo

Veera Raghava Reddy Kakireddy

Sivakumar Dhandapani

Boyi Fu

Ashwin Chockalingam

Mayu Felicia Yamamura

Hou Tee Ng

Stan D Tsai

Charles C Garretson

Ashavani Kumar

Benjamin A Bonner

Venkat Hariharan

Amritanshu Sinha

Jeonghoon Oh

Thomas H Osterheld

Shou-Sung Chang

Jun Qian

Robert L Jackson

Christopher Heung-Gyun Lee

Yin Yuan

Christopher Cocca

John Watkins

Steven M Zuniga

Boguslaw A Swedek

Hung Chih Chen

Jeffrey Drue David

Errol Antonio C Sanchez

Robert D Tolles

Benjamin Cherian

Yi-Chiau Huang

Doyle E Bennett

Jay Gurusamy

You Wang

Daxin Mao

Bingxi Sun Wood

Timothy B Michaelson

Ekaterina A Mikhaylichenko

Sameer Deshpande

Jie Diao

Adam Zhong

Huyen Karen Tran

Vasanth N Mohan

Asheesh Jain

Henry H Au

Eric Davey

Robert A Marks

Yi-Yung Tao

Rob Davenport

Venkatachalam Hariharan

Raghava Kakireddy

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

Techniques for combining CMP process tracking data with 3D printed CMP consumables

Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

CMP pad construction with composite material properties using additive manufacturing processes

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

Polishing pads produced by an additive manufacturing process

A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or 'micro-features' and/or a plurality of grooves or 'macro-features' formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.

Thin plastic polishing article for CMP applications

Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.

Printed chemical mechanical polishing pad

A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.

Endpointing with selective spectral monitoring

Growing community of inventors

Pleasanton, CA, United States of America

Gregory E Menk