Intel Corporation

Inter Corporation

Gregory E Dermer

Nitin Y Borkar

Linda J Rankin

Kai Cheng

Wen-Hann Wang

Paul R Pierce

Richard H Hofsheier

Stephen R Mooney

Rajendran Nair

Shekhar Yeshwant Borkar

Chris S Browning

A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.

Scalable distributed memory and I/O multiprocessor system

A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BICS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.

Scalable memory and I/O multiprocessor systems

Scalable distributed memory and I/O multiprocessor systems and associated methods

A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.

A low jitter external clocking system and method are disclosed. According to one embodiment of the present invention, a differential clock signal is received on a first clock signal line and a second clock signal line. A differential amplifier coupled to the first clock signal line and the second clock signal line amplifies the differential clock signal into a single-ended output clock signal.

Low jitter external clocking

A method and apparatus for power throttling in a microprocessor. A voltage source supplies voltage to the microprocessor, and a clock source operates the microprocessor at a desired frequency. In one embodiment, a power monitor is configured to measure the short term power consumption of the microprocessor. In another embodiment, a temperature sensor measures the temperature of the microprocessor. Control logic is coupled to the voltage source and the clock source. The control logic receives an indication of the power consumption or temperature, as applicable, and compares it to a predetermined value. In response to the comparison, the control logic varies the supply voltage and the frequency.

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Portland, OR, United States of America

Gregory E Dermer