Kaneka North America LLC

Gregory Douglas Clements

Haibin Zheng

Blair Gordon Jones

Toshinori Mizuguchi

Grant Richard Lee

Manish Maheshwari

Multilayer polyimide-fluoropolymer insulation structures exhibiting excellent copper heat seal strength and superior internal adhesion strength comprise a layer of polyimide having first and second major surfaces and at least a first fluoropolymer layer wherein the first fluoropolymer layer comprises fluoropolymer, metal oxide and ammonium salt. Protected wire or cable using the multilayer insulation structures, are also described.

Polyimides and fluoropolymer bonding layer with improved copper heat seal strength

Multilayer polyimide-fluoropolymer insulation structures exhibiting excellent heat seal strength and superior internal adhesion strength comprise a base layer of polyimide having first and second major surfaces and a first fluoropolymer layer. The first fluoropolymer layer may be on the first major surface of the polyimide layer. Alternatively, it may be separated from the first major surface of the polyimide layer by an intervening layer. The first fluoropolymer layer comprises from about 70 to about 98% by weight of fluoroethylene propylene polymer ('FEP') and from about 30 to about 2% by weight of polytetrafluoroethylene polymer ('PTFE') or poly(tetrafluoroethylene-co-perfluoro[alkyl vinyl ether]) (&#x2018;PFA&#x2019;) based on the total weight of the first fluoropolymer layer. Structures having fluoropolymer layers on both surfaces of the polyimide layer are also provided. Protected wire or cable using the composite, and methods are also described.

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League City, TX, United States of America

Gregory Douglas Clements