Varian Semiconductor Equipment Associates, Inc.

General Electric Company

Gregory Citver

Yuri Lvovsky

William Louis Einziger

Frank Sinclair

Hendrik Pieter Jacobus De Bock

Ernst Wolfgang Stautner

Eric D Hermanson

Longzhi Jiang

Kasegn D Tekletsadik

Roger Bradford Fish

D Jeffrey Lischer

Kathleen Melanie Amm

Tao Deng

Tao Zhang

Jalal Hunain Zia

Charles L Stanley

Semaan Y Fersan

Scott W Nickerson

Wen Shang

Nandishkumar Desai

Disclosed is a thermosyphon system for cooling a platen in an ion implantation system. The thermosyphon system may include a vacuum chamber housing at least one wafer platen and a phase separator tank operative to contain both a liquid and gas phases of an element. A re-condensing cold head is exposed within the phase separator tank and is operative to condense the element from its gas phase to its liquid phase. This creates a convection driven closed loop pipe configuration. The closed loop pipe configuration includes a liquid phase pipe to carry the lower temperature liquid phase from the phase separator tank to the platen in the vacuum chamber. A reaction with the warmer platen converts the liquid phase to the gas phase. A gas phase pipe carries the higher temperature gas phase from the platen in the vacuum chamber back to the phase separator tank.

Wafer platen thermosyphon cooling system

Techniques for protecting a superconducting (SC) article are disclosed. The techniques may be realized as an apparatus for protecting a superconducting (SC) article. The apparatus may comprise a porous sleeve configured to fit around the superconducting (SC) article. The porous sleeve may be made of non-conductive, dielectric material.

Techniques for protecting a superconducting (SC) tape

A current lead with a configuration to reduce heat load transfer in an alternating electrical current (AC) environment is disclosed. The current lead may comprise a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the current lead. A temperature gradient a may be exhibited along a length of the current lead.

Current lead with a configuration to reduce heat load transfer in an alternating electrical current environment

A displacer for adjusting a level of a liquid cryogen in a cryostat. The displacer including an expandable member at least partially defining a sealed chamber. The expandable member being configured to transition from a collapsed state where the sealed chamber has a smaller volume to an expanded state where the sealed chamber has a larger volume. The displacer includes a first end piece attached to a first end of the expandable member and a second end piece attached to a second end of the expandable member.

Displacer and superconducting magnet

A cryogenic cooling system includes a chamber defined by an outer wall and an inner wall, the chamber housing at least one component to be cooled; a wicking structure in thermal contact with one of the outer wall and the inner wall of the chamber; and a delivery system in a spaced apart relationship with the chamber and fluidly connected to the wicking structure for transporting a working fluid to and from the wicking structure. Also provided is a magnetic resonance imaging system including the cryogenic cooling system.

Cryogenic cooling system with wicking structure

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Danvers, MA, United States of America

Gregory Citver