Texas Instruments Corporation

Other

Gregory Barton Hotchkiss

Jules D Levine

Gonzalo Amador

Darvin R Edwards

Millard J Jensen

Gary D Stevens

Milfred D Hammerbacher

Kurt Peter Wachtler

Katherine G Heinen

Michael F Chisholm

Reynaldo M Rincon

Sidney G Parker

Robert J Lessard

M'Hamed Ibnabdeljalil

Millard J Jensen, Deceased

Paul R Sharrock

Viswanathan Sundararaman

Jackie C Simmons

The invention discloses a method for attaching solder members ( ) to a substrate ( ). The method includes forming a decal ( ) with a plurality of solder members ( ). The method further comprises aligning the decal ( ) with the substrate ( ) and transferring the solder members ( ) on the decal ( ) to the substrate ( ).

Method and apparatus for attaching solder members to a substrate

A conductive via pattern ( ) between the uppermost metal interconnect layer (M ) and next underlying metal interconnect layer (M ) in the bond pad areas strengthens the interlevel dielectric (ILD ) between metal layers (M and M ). The conductive via layer ( ) may, for example, comprise parallel rails ( ) or a grid of cross-hatch rails ( ). By spreading the stress concentration laterally, the conductive via layer ( ) inhibits micro-cracking from stress applied to the bond pad ( ).

Approach to structurally reinforcing the mechanical performance of silicon level interconnect layers

A wafer-scale assembly apparatus for integrated circuits and method for forming the wafer-scale assembly. A semiconductor wafer including a plurality of circuits is provided with a plurality of metal contact pads as electrical entry and exit ports. A first wafer-scale patterned polymer film carrying solder balls for each of the contact pads on the wafer is positioned opposite the wafer, and the wafer and the film are aligned. The film is brought into contact with the wafer. Radiant energy in the near infrared spectrum is applied to the backside of the wafer, heating the wafer uniformly and rapidly without moving the semiconductor wafer. Thermal energy is transferred through the wafer to the surface of the wafer and into the solder balls, which reflow onto the contact pads, while the thermal stretching of the polymer film is mechanically compensated. The uniformity of the height of the liquid solder balls is controlled either by mechanical stoppers or by the precision linear motion of motors. After cooling, the solder balls solidify and the first polymer film is removed.

Wafer-scale assembly of chip-size packages

A semiconductor wafer is disclosed comprising a substrate having a surface carrying an array of integrated circuit chips bordered by dicing lines; at least two sets of substantially parallel structures within each of said dicing lines, each set extending along the edge of a chip on opposite sides of each dicing line, respectively; each of said sets comprising at least one continuous barrier wall adjacent each chip, respectively, and a sacrificial composite structure in combination therewith, between said wall and the center of the dicing line, said composite structure including means of dispersing the energy associated with crack propagation, whereby any crack having sufficient energy to penetrate the composite structure will be transformed into a plurality of weaker cracks, non of which will be capable of penetrating said wall.

Sacrificial structures for arresting insulator cracks in semiconductor devices

A method for loading solder particles (,) onto an substrate comprising applying a flux (,) directly onto solder particles (,) either prior to or following adhering the solder particles (,) onto adhesive areas (,) of an adhesive coated film (,). The adhesive areas (,) of the adhesive coated film (,) are oriented to correspond with contact pads (,) of a substrate (,). The adhesive coated film (,) is aligned with the substrate (,) to transfer the solder particles (,) to the contact pads (,). The solder particles (,) may then be reflowed to securely attach the solder particles (,) to the contact pads(,).

Method for the transfer of flux coated particles to a substrate

An apparatus for mass fabrication of a semiconductor assembly comprising optical sources for supplying radiant energy for rapid and controlled heating of a multitude of integrated circuit chips and substrates. The resultant thermal profile is applied to reflowing solder interconnections as well as to filling chip-to-substrate gaps with polymeric precursors whereby any mechanical stress detrimental to mechanically weak solder joints and dielectric layers is avoided. The apparatus contains dispensing equipment with multiple degrees of freedom so that the chips and substraters to be assembled do not have to be moved within or from the apparatus. Processing in controlled environment is feasible.

Low stress method and apparatus of underfilling flip-chip electronic devices

A method for attaching particles (,) to a substrate (,), comprising the steps of aligning particles (,) attached to an adhesive sheet (,) with contact pads (,) of a substrate (,), transferring thermal energy (,) to the adhesive sheet (,) by maintaining a temperature below the melting point of particles (,), and removing the adhesive sheet (,) prior to reflow, is disclosed. The adhesive sheet (,) may be composed of an adhesive coating (,) laminated to a film (,). The particles may be composed of a variety of compositions, including compounds such as solder or plastic, for example.

Method for transferring particles from an adhesive sheet to a substrate

A method for assembling electronic devices by moving particles (,) on an adhesive sheet (,) having a plurality of adhesive areas (,), comprising the steps of loading the particles (,) onto the adhesive sheet (,) and transferring kinetic energy from a mechanical device (,) to the particles (,) for moving the particles (,) is disclosed. The adhesive sheet (,) may be composed of an adhesive coating (,) laminated to a film (,). The particles (,) may be composed of a variety of materials, including minerals and compounds such as solder or polymers.

Method and apparatus for populating an adhesive sheet with particles

A novel technique for measuring the temperature of an electronic circuit undergoing assembly packaging processes includes a non-contact infrared detector which is used to measure the temperature of the die allowing a control systems to directly adjust the die temperature. Previous to this invention, the die temperatures were controlled indirectly, typically by controlling ambient temperature in an oven or furnace to a series of set point values during curing of the electronic packaging materials.

Method and apparatus for measuring temperatures during electronic

A method for populating an substrate (14) with particles (12, 16), comprising the steps of applying an adhesive coating (22) to both surfaces of a substrate (14) and loading the particles (12, 16) to the adhesive areas (30) of the adhesive coating (22), such that each surface of the substrate (14) is fully populated with the particles (12, 16) which may thereafter be reflowed simultaneously. The particles may be composed of a variety of compositions, including copper, other metals, alloys, and synthetic resin compounds, such as conductive plastics.

Method and apparatus for the attachment of particles to a substrate

The invention discloses a method for forming solder (114) on a substrate (112). The method includes forming a decal (110) with a plurality of solder regions (113). The method further comprises aligning the decal (110) with the substrate (112) and transferring the solder regions (113) on the decal (110) to the substrate (112).

Method and apparatus for forming solder on a substrate

An improved method of affixing spheres 4 to a foil matrix 2 is described herein. First, a cell sandwich 32 is prepared. This cell sandwich 32 includes spheres 4 mounted on a foil matrix 2 which are disposed between upper and lower pressure pads 34 and 36. The cell sandwich 32 is then heated (e.g., to about 530.degree. C.). The spheres 4 are then affixed to the foil matrix 2 by directing the cell sandwich 32 through a roll press 48 which compresses the heated cell sandwich 32.

Method and apparatus for affixing spheres to a foil matrix

An improved method of affixing spheres 4 to a conductive foil sheet 28 is described herein. A cell matrix is provided. The cell matrix includes a conductive foil matrix 2 with spheres 4 mounted therein. Each of the spheres 4 has an insulating layer 20 disposed on it. A portion of this insulating layer 20 is removed from each of the spheres 4 to expose a portion 22 of the spheres 4. A cell sandwich 32 is then formed between an upper pressure pad 34 and a lower pressure pad 36. The cell sandwich 32 includes the cell matrix 2/4 and a conductive foil 28. The cell sandwich 32 is then heated (preferably to between about 350.degree. and 450.degree. C.). The spheres 4 are then affixed to the conductive foil 28 by compressing the cell sandwich 32. In one embodiment, the compression takes place in a roll press 48.

Method and apparatus for affixing spheres to a conductive sheet

A cover (14) for an array (12) of foil matrix-mounted (18), spaced photovoltaic members (16) protects the array (12) from the environment and increases its efficiency. Upper portions (31) of the members (16) extend above the free reflective surface (20T) of the foil matrix (18). The cover (14)includes an environment-excluding coating (60) which is emplaced on the array (12) to conform to the upper portions (31). The coating is configured as cusps (68) which overlie the free surface (20T) of the matrix (18) centrally between adjacent members (16). The nadirs (72) of the cusps (68) are closely spaced from the free surface (20T). Accordingly, each member (16) effectively supports a conformal lens (70) which directs thereat much of the otherwise 'wasted' light that would fall on the free foil surface (20T) between adjacent members (16) and would not fall on the members (16).

Array of solar cells having an optically self-aligning,

Solar cells are formed of semi-conductor spheres of P-type interior having an N-type skin are pressed between a pair of aluminum foil members forming the electrical contacts to the P-type and N-type regions. The aluminum foils, which comprise 1.0% silicon by weight, are flexible and electrically insulated from one another. The sphere are patterned in a foil matrix forming a cell Multiple cells can be interconnected to form a module of solar cell elements for converting sun light into electricity.

Growing community of inventors

Richardson, TX, United States of America

Gregory Barton Hotchkiss