Intel Corporation

Verizon Patent and Licensing Inc.

Gregory Alan James

Jinwoo Kim

Simon Waterfall

Gadi Amit

Chadwick John Harber

Rakesh Bhatia

Suri B Medapati

Julien Rouillac

Michael J Castillo

Susan McKinney

Brian G Heintz

Fraser Stirling

Simon J Waterfall

Edward Owen Clapper

Ravi V Mahajan

Hong Xie

Larry Louis Moresco

Kristopher J Frutschy

David George Payne

Byron Ben-Ming Hsieh

Steve Sichi Chen

Ricardo Penate

Neil C Delaplane

Sean L Carter

Byron Ming Hsieh

Kelvin Leung

Susan Mckinney

Byron B Hsieh

Denise Myers

Nicholas Long

Communication device

A retaining clip is provided for use with a heat sink. The heat sink has a flat bottom surface in heat conducting engagement with an electronic device and fins extending from a top surface of the heat sink, the fins defining a channel. The retainer clip includes a middle section and a first end section and a second end section on either side of the middle section. The middle section fits within the channel and engages the heat sink to hold the bottom surface against the electronic device. The middle section further includes a portion extending above the top surface, within the channel, to limit rotation of the heat sink. Each of the first and second end sections include a pivot end adjacent to the middle section, a distal end to engage an anchor, a first leg adjacent to the distal end, a second leg adjacent to a pivot end, and a bend between the first leg and the second leg, the bend located to form a moment arm from the pivot end.

Heat sink retention spring clip

Electronics box

Set-top box

Remote control

A heat dissipating element (e.g., a heat sink) is held in an initial position closer to a heat generating structure (e.g., a microprocessor) and in a subsequent position farther from the microprocessor. A thermal interface material (e.g., a thermal grease) spans the gap, but is not held under compression, between the heat sink and the microprocessor.

Thermal gap control

A method and apparatus for an electromechanically controlled electronic interface plug. The interface plug provides electrical connection with a complementary connector while providing electromechanical control over the ability to disconnect or decouple the interface plug. When the prevention mechanism is in an engaged position it prevents decoupling the interface plug. When the prevention mechanism is in a disengaged position it allows decoupling the interface plug. An electrical signal controls whether the prevention mechanism moves from the engaged to the disengaged position. An electronic controller provides the electrical signal when it is determined safe to allow the interface plug to decouple. The electromechanical interface plug is especially useful in notebook computer docking/undocking applications where the notebook computer must be in a safe state before undocking can occur.

Method and apparatus for an electromechanically controlled electronic interface plug

An apparatus is disclosed for attaching a thermal solution to a mini-cartridge. The apparatus comprises: a bracket adapted to be snapped into position around the mini-cartridge; two or more threads formed in the bracket, the threads positioned such that when the bracket is snapped into position around the mini-cartridge the threads are located on the side of the mini-cartridge opposite from the side adjacent to the thermal solution; and screws adapted to run through holes in the mini-cartridge to engage with the threads and to fixedly attach the thermal solution to the mini-cartridge.

Thermal attachment bracket for mini cartridge package technology

A coupling such as a socket may couple one electronic device to another and may reduce differential thermal expansion between the two coupled devices. For example, a surface mount socket may differentially expand relative to a printed circuit board. By incorporating a structure having a coefficient of thermal expansion that matches the coefficient of thermal expansion of the printed circuit board, differential thermal expansion may be lessened and the possibility of mechanical damage may be reduced.

Controlling the heat expansion of electrical couplings

An electronic cartridge comprising a cartridge substrate, a package substrate, an integrated circuit, and an enclosure. The package substrate is mounted to the cartridge substrate. The integrated circuit is mounted to the package substrate. The enclosure encloses the integrated circuit, the package substrate and the cartridge substrate.

Cartridge and an enclosure for a semiconductor package

Growing community of inventors

San Jose, CA, United States of America

Gregory Alan James