Energy Innovations, Inc.

Other

Iqinvision, Inc.

Gregory Alan Bone

Andrew Peter Homyk

Jonathan M Walton

A software development kit prioritizes certain aspects of an acquired image and introduces the prioritized aspects to a main processor. Alternatively, a coprocessor, or the coprocessor and the development kit, manipulate(s) the acquired image and introduce(s) the manipulated image to the processor. The reprogramming of either one of the development kit and the coprocessor may be initiated by either one of them or by the processor and the programming may be provided by the main processor. A central station and a gate array may also be individually reprogrammable by the main processor which sets up, programs and controls an intelligent imaging platform in accordance with the individual reprogrammings. A reprogramming of an audio acquisition stage may also be initiated by that stage and any of the other stages and the processor and may be provided by the processor. The audio information may be related to the acquired image.

System for, and method of, processing an image

An automated tracking solar power collector is disclosed herein, the tracking solar powered collector includes at least one solar collector such as a solar concentrator and an actuator coupled to the at least one solar collector. The tracking solar power collector further includes a tracking controller configured to aim the at least one solar collector toward the sun with the actuator; and, a power controller configured to supply power to the actuator based on an energy collected by the at least one solar collector.

Automated solar tracking system

A system and method is disclosed for bonding a substrate to a semiconductor die that is prone to curling when subjected to an elevated temperature in a solder reflow oven, for example, thereby improving the electrical and mechanical bonding for large dies, wafers, chips, and photovoltaic cells. In one embodiment, the substrate is adapted to curl to the same degree as the die to form a uniform gap between the substrate and die across the boundary there between. In another embodiment, solder used to bond the die and substrate is applied such that the volume deposited varies based on the expected gap between the die and substrate when heated to the melting temperature of the solder.

Growing community of inventors

Santa Monica, CA, United States of America

Gregory Alan Bone