Micron Technology Incorporated

Agere Systems Guardian Corp.

Gregory A King

Chan H Yoo

Randon K Richards

Yogesh Sharma

Thomas H Kinsley

George Edward Pax

Layne G Bunker

Jeremy Robert Kuehlwein

Dragos Dimitriu

Ebrahim H Hargan

Timothy Mowry Hollis

Eric J Stave

Steven G Wurzer

George E Pax

Liuchun Cai

Michael McMahon

Daniel Meier

Michael Stay

Robert L Rabe

Steven V Stang

Gregory P Micko

Paul F Cisewski

Brian J Sandvold

Earl E Wentzel

Brant R Gourley

Systems, apparatuses, and methods for operating a memory device or devices are described. A memory device or module may introduce latency in commands to coordinate operations at the device or to improve timing or power consumption at the device. For example, a host may issue a command to a memory module, and a component or feature of the memory module may receive the command and modify the command or the timing of its execution in manner that is invisible or non-disruptive to the host while facilitating operations at the memory module. In some examples, components or features of a memory module may be disabled to effect or introduce latency in operation without affecting timing or operation of a host device. A memory module may operate in different modes that allow for different latencies; the use or introduction of latencies may not affect other features or operability of the memory module.

Methods for memory power management and memory devices and systems employing the same

An apparatus is provided, comprising a plurality of memory devices and a buffering device that permits memory devices with a variety of physical dimensions and memory formats to be used in an industry-standard memory module format. The buffering device includes memory interface circuitry and at least one first-in first-out (FIFO) or multiplexer circuit. The apparatus further comprises a parallel bus connecting the buffering device to the plurality of memory devices. The parallel bus includes a plurality of independent control lines, each coupling the memory interface circuitry to a corresponding subset of a plurality of first subsets of the plurality of memory devices. The parallel bus further includes a plurality of independent data channels, each coupling the at least one FIFO circuit or multiplexer circuit to a corresponding subset of a plurality of second subsets of the plurality of memory devices.

Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilities

Systems, apparatuses, and methods relating to memory devices and packaging are described. A device, such as a dual inline memory module (DIMM) or other electronic device package, may include a substrate with a layer of graphene configured to conduct thermal energy (e.g., heat) away from components mounted or affixed to the substrate. In some examples, a DIMM includes an uppermost or top layer of graphene that is exposed to the air and configured to allow connection of memory devices (e.g., DRAMs) to be soldered to the conducting pads of the substrate. The graphene may be in contact with parts of the memory device other than the electrical connections with the conducting pads and may thus be configured as a heat sink for the device. Other thin, conductive layers of may be used in addition to or as an alternative to graphene. Graphene may be complementary to other heat sink mechanisms.

Memory modules and memory packages including graphene layers for thermal management

Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. An apparatus may have a printed circuit board (PCB) having an edge connector. At least one integrated circuit device may be disposed on a surface of the PCB. A tubular heat spreader may be disposed along an edge of the PCB opposite the edge connector.

Tubular heat spreaders for memory modules and memory modules incorporating the same

According to one embodiment, an apparatus comprises a differential signaling bus, a tristate transmitter connected with the differential signaling bus, the tristate transmitter configured to provide a signal on the differential signaling bus responsive to a corresponding control signal, a receiver, a pair of differential inputs of the receiver connected with the differential signaling bus and configured to receive the signal from the differential signaling bus, and a termination circuit configured to couple a first differential input of the pair of differential inputs to a first voltage source and to couple a second differential input of the pair of differential inputs to a second voltage source, wherein the first and second voltage sources have different voltage levels.

Methods and apparatuses for differential signal termination

Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. For example, a memory module may have a printed circuit board (PCB) having an edge connector, a plurality of memory devices disposed on a surface of the PCB, and a tubular heat spreader disposed along an edge of the PCB opposite the edge connector. The tubular heat spreader may comprise a tubular portion open at both ends thereof to permit the through flow of a cooling gas; and two planar elements extending in parallel away from the tubular portion and configured to provide a friction fit with the memory module. Each of the planar elements may be configured to convey thermal energy from the memory module to the tubular portion.

Various embodiments include apparatus and methods to track and/or correct timing signals. Timing signals generated from an interface can be compared to the timing signals returned to the interface. A timing delta from the comparison can be applied to calculate a correction value make adjustments that can include adjustment to a subsequent timing signal, adjustment to a reference voltage setting associated with the subsequent timing signal, other adjustments, or combinations thereof. Additional apparatus, systems, and methods are disclosed.

Tracking and correction of timing signals

Apparatuses and methods for quadrature signal generation are provided. An example includes a quadrature signal generator. The quadrature signal generator is configured to generate, based on a received differential signal, a plurality of quadrature clock signals at a same frequency as that of the received differential signal. The quadrature signal generator is also configured to provide the plurality of quadrature clock signals to a memory system.

Quadrature signal generation

A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.

Apparatus and methods for through substrate via test

Apparatuses and methods for controlling access to a common bus including a plurality of memory devices coupled to a common bus, wherein individual ones of the plurality of memory devices are configured to access the common bus responsive to a strobe signal, and a strobe line driver programmed with a first delay associated with a combination of a first command type and a first one of the plurality of memory devices to provide a first strobe signal to the first one of the plurality of memory devices, and further programmed with a second delay associated with a combination of a second command type and a second one of the plurality of memory devices to provide a second strobe signal to the second one of the plurality of memory devices.

Method and apparatus for controlling access to a common bus by multiple components

Methods, systems, and devices for mitigating supply noise in single-ended current mode logic (CML) transmitters are described. A first current source may generate a first bias current for a first differential transistor pair included in a CML transmitter, and a second current source may generate a second bias current for a second differential transistor pair. The first differential transistor pair may route the first bias current through either leg of the first differential transistor pair based on a polarity of an input signal and the second differential transistor pair may route the second bias current through either leg of the second differential transistor pair based on the polarity of the input signal. Based on a first polarity, the second bias current may be routed to a ground reference, and based on a second polarity, the second bias current may be routed through the first differential transistor pair to modify a load current internal to the CML transmitter.

Growing community of inventors

Hastings, MN, United States of America

Gregory A King