At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Infineon Technologies Ag

Rosenberger-Osi Gmbh & Co. Ohg

At&s Ag

Tridonic Jennersdorf Gmbh

Gregor Langer

Johannes Stahr

Stefan Woehlert

Stefan Krivec

Ronny Kern

Stefan Kramp

Hannes Winkler

Andreas Zluc

Timo Schwarz

Markus Riester

Hans-Joachim Schulze

Werner Schustereder

Alexander Stuck

Moriz Jelinek

Peter Pachler

Alexander Kasper

Ferdinand Lutschounig

Clemens Wurster

Christian Sommer

Kristijan Luka Mletschnig

Mario Damej

Stefan Schmidt

Hannes Stahr

Axel König

Bernhard Leitl

Anna SZÜCS

A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps:

Method for embedding a component in a printed circuit board

A method of manufacturing a metal silicide layer comprises performing laser thermal annealing of a surface region of a silicon carbide (SiC) substrate, exposing a surface of a thus obtained silicon layer, depositing a metal layer above the exposed silicon layer, and/or thermally treating a stack of layers, comprising the silicon layer and the metal layer, to form a metal silicide layer. Alternatively and/or additionally, the method may comprise depositing a silicon layer above a SiC substrate, depositing a metal layer, and/or performing laser thermal annealing of the SiC substrate and a stack of layers above the SiC substrate to form a metal silicide layer, wherein the stack of layers comprises the silicon layer and the metal layer. Moreover, a semiconductor device is described, comprising a SiC substrate, a metal silicide layer, and a polycrystalline layer in direct contact with the SiC substrate and the metal silicide layer.

Method of manufacturing a metal silicide layer above a silicon carbide substrate, and semiconductor device comprising a metal silicide layer

A chip is provided. In an embodiment, the chip includes a silicon carbide substrate, a first sputtered metal layer on the silicon carbide substrate, and at least one second sputtered metal layer on the first sputtered metal layer. The first sputtered metal layer and the at least one second sputtered metal layer form an electrical contact. In another embodiment, the chip includes a silicon carbide substrate, a nickel-silicon layer on the silicon carbide substrate, and a layer sequence including a titanium layer, a nickel-containing layer, and a gold-tin or silver layer on the nickel-silicon layer.

Chip with a silicon carbide substrate

A process for producing an electrical contact with a first metal layer and at least one second metal layer on a silicon carbide substrate includes removing at least some of the carbon residue by a cleaning process, to clean the first metal layer. The first metal layer and/or the at least one second metal layer may be generated by sputtering deposition.

Process for producing an electrical contact on a silicon carbide substrate

A process for producing an electrical contact with a first metal layer and at least one second metal layer on a silicon carbide substrate includes removing at least some of the carbon residue by a chemical cleaning process, to clean the first metal layer. The first metal layer and/or the at least one second metal layer may be generated by sputtering deposition.

Electrical contact connection on silicon carbide substrate

Method of embedding a component in a printed circuit board

An electronic module and method for the production of the electronic module in accordance with some embodiments of the invention are disclosed. The electronic module includes at least one electronic component affixed to a conductive layer by means of sticky electrically insulating layer, where the electronic component is embedded in a transparent foil. The electronic module is produces by providing an electrically conductive layer. At least one electronic component is affixed to the electrically conductive layer by means of a sticky electrically insulating layer and embedded in a transparent foil. The at least one electronic component is electronically contacted with the conductive layer.

Method for the production of an electronic module having an electronic component embedded therein

The invention relates to a circuit board element () comprising a substrate (), on which at least one dielectric layer () is arranged, and at least one LED (light-emitting diode) (), wherein at least one channel-shaped waveguide cavity () leading away from the LED () is provided in the dielectric layer (), which waveguide cavity leads to at least one integrated light-sensitive component (), preferably a photo-diode or photocell, arranged for examining the light emission, wherein the LED () is preferably also arranged in a cavity () that is connected to the waveguide cavity (). The invention further relates to a method for producing such a circuit board element ().

Circuit board element having at least one LED

Method for the manufacture of a printed circuit board with at least one cavity for the accommodation of an electronic component, wherein the cavity walls exhibit a reflective, in particular mirrored reflector layer characterized by the following steps: Provision of a printed circuit board, Application of a temporary protective layer onto at least a section of the surface of the circuit board, Creation of the cavity by way of penetration of the protective layer in the region of the cavity, Application of the reflector layer, Removal of the temporary protective layer.

Method for producing a circuit board

An optical coupling system for coupling a first optical waveguide having a first core surrounded by a first sheath to a second optical waveguide having a second core surrounded by a second sheath. An end face of the first core of the first optical waveguide abuts an end face of the second core of the second optical waveguide at a coupling location and the second core is flush with the first core in the axial direction, wherein, in the region of the coupling location, over at least part of a predetermined axial portion, both the second sheath of the second optical waveguide and the first sheath of the first optical waveguide together form a cladding of the optical waveguide in the predetermined portion.

Optical coupling system for two optical waveguides

The invention relates to a printed circuit board element (), comprising at least one flexible printed circuit board part () and at least one rigid printed circuit board part (A,C;) having a component (), which is accommodated in a cavity () and with a light-emitting or light-receiving part () projects over the edge () of the cavity (), wherein the flexible printed circuit board part () has a flexible layer () made of an optical, photo-polymerizable material (), in which an optical fiber () is structured in alignment with the light-emitting or light-receiving part () of the optoelectronic component () by way of radiation.

Printed circuit board element and method for the production thereof

A printed circuit board element () with a substrate (), with at least one optoelectronic component () embedded in a photopolymerizable optical layer material (), and with at least one optical waveguide () optically coupled with the former and structured in the optical material by photon absorption, wherein a prefabricated deflection mirror () embedded in the optical material () and optically coupled with the optoelectronic component () via the optical waveguide () is arranged on the substrate (), optionally together with a support (').

Printed circuit board element and method for producing the same

The invention relates to a printed circuit board element () including at least one optoelectronic component () which is embedded in an optical, photopolymerizable layer material (), and at least one optical waveguide () optically coupled thereto, which is structured in the optical, photopolymerizable material () by photon irradiation, wherein the component () comprises a curved deflection mirror () on its light transmission surface (), which curved deflection mirror deflects the light radiation (), for instance by 90&#xb0;.

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Wölfnitz, Austria

Gregor Langer