Minnesota Mining and Manufacturing Company

3m Innovative Properties Company

Magma Flooring LLC

Other

Stratasys, Inc.

Greggory S Bennett

Christopher A Haak

Louis E Winslow

Gaddam N Babu

Richard E Bennett

Craig A Gustafson

Jeffrey Jacob Cernohous

Michael A Kropp

Cheryl L Moore

Guido Hitschmann

Michele A Craton

Ashish Kumar Khandpur

Shih-Hung Chou

Kejian Chen

Karunasena A Alahapperuma

Brandon J Cernohous

Vance Warren Zins

Garrett S Van Gorden

Steven M Heilmann

Tatsuo Fukushi

William D Coggio

Allen Raymond Siedle

Eugene G Joseph

Clayton Allen George

George F Vesley

Cristina U Thomas

Bimal V Thakkar

Kurt C Melancon

Gina M Buccellato

Bhaskar V Velamakanni

Adam R Pawloski

Patrick G Zimmerman

Allan T Worm

Todd Richard Sarnstrom

Michael L Tumey

Sithya S Khieu

Howell K Smith, Ii

Erik D Hare

Paul Hattam

Kent Kaske

Gary R Miron

Wolfgang G Schoeppel

Alain Henri Lamon

Christopher Jon Krueger

Daniel Lee Thron

Todd Richard Samstrom

Yolanda Griebenow

Adam E Szymanski

A polymeric composite derived from a reclaimed polymeric material. The polymeric composite in particulate form can be thermally compressed into panels and other embodiments that require a component that possesses sufficient mechanical strength and moisture resistance. In certain embodiments, the panel may be utilized as one layer in a multilayered article.

Polymeric composites, resulting panels, and method for producing the same

Articles and methods of manufacture of poly(vinyl chloride)-based substrates are described. The substrates may be utilized in various consumer, industrial, transportation, building and construction, and agricultural applications and may include reclaimed poly(vinyl chloride).

Poly(vinyl chloride) substrates and method for producing the same

A substrate and method for providing a thermoplastic composite having a fiberglass mat embedded within a thermoplastic polymer. The characteristics of the fiberglass mat combined with a thermal compression bonding method allow for a substantially improved and desirable thermal expansion coefficient over conventionally filled thermoplastic substrates or other fiberglass reinforced thermoplastics.

Polymeric substrates with an improved thermal expansion coefficient and a method for producing the same

A compound is prepared, suitable for forming fluoroelastomers, having the unique features of a low glass transition temperature and desirable permeation resistance. The compound generally comprises two primary components. The first component is an amorphous copolymer including interpolymerized units derived from one or more perfluorinated ethers. The second component is a curable component including at least one filler having at least 10 parts per 100 parts of the first component. Upon vulcanization the resulting elastomeric compound has desirable physical characteristics as indicated by the durometer, the retraction at lower temperatures (TR-10) and permeation resistance.

Fluoroelastomers with improved permeation resistance and method for making the same

A pavement marking article that has an adhesive composition for adhering the article to a pavement substrate, where the adhesive composition includes a reaction product of an acrylic acid ester of a monohydric alcohol whose homopolymer has a Tg less than 0&#xb0; C., a non-polar ethylenically unsaturated monomer, and 0-10 parts by weight of a polar ethylenically unsaturated monomer. Preferably the amount of the acrylic acid ester is about 60-90 parts by weight, and the amount of the non-polar ethylenically unsaturated monomer is about 10-40 parts by weight. Also, a raised pavement marker that comprises: Raised pavement markers that use a pressure sensitive adhesive meeting parameters (i)-(iii) can demonstrate good adhesion to roadways and are capable of withstanding repeated impacts from motor vehicle tires.

Pavement marking article and raised pavement marker that uses pressure sensitive adhesive

Polycarbonate articles and adhesive composition therefor

An article is disclosed that includes a) a first polycarbonate substrate; b) a second polycarbonate substrate; and c) an adhesive composition disposed between the first polycarbonate substrate and the second polycarbonate substrate such that the first polycarbonate substrate is bonded to said second polycarbonate substrate through the adhesive composition; the adhesive composition includes an adhesive polymer that includes the reaction product of 1) an N-vinyl containing monomer selected from the group consisting of N-vinyl caprolactam, N-vinyl pyrrolidone, and N-vinyl imidazole, and combinations thereof, and 2) an acrylic acid ester monomer of a non-tertiary alcohol having an alkyl group that includes 4 to 20 carbon atoms.

The present invention relates to a blend of at least one amorphous ethylene/propylene-derived copolymer, at least one non-stereoregular propylene-derived polymer having a melt viscosity of greater than about 500 Poise, and an optional tackifier that provide pressure-sensitive adhesive compositions in which a good balance of adequate adhesion to both low and relatively high surface energy substrates can be achieved.

Pressure-sensitive adhesive blends comprising ethylene/propylene-derived polymers and propylene-derived polymers and articles therefrom

A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Semiconductor wafer processing tapes

The present invention relates to a blend of at least one (meth)acrylate polymer and at least one amorphous propylene-derived polymer, and an optional tackifier that provide pressure sensitive adhesive compositions in which improved peel adhesion to at least one of low and relatively high surface energy substrates can be achieved.

Pressure sensitive adhesive blends comprising (meth)acrylate polymers and articles therefrom

Pressure-sensitive adhesive tape

Method of manufacturing an optical recording medium

Pressure sensitive adhesives and heat activatable adhesives that are the reaction product of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.; a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C.; 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C.; and an electrically conductive agent.

Adhesives containing electrically conductive agents

Growing community of inventors

Hudson, WI, United States of America

Greggory S Bennett