Siemens Medical Solutions Usa, Inc.

Fujifilm Sonosite, Inc.

Gregg W Frey

Wei Li

Todor Sheljaskow

Grazyna M Palczewska

Simon Hsu

Robert Mallory

Sevig Ayter

Stephen Roy Barnes

Mirsaid Seyed Bolorforosh

Worth B Walters

Nelson H Oliver

Xiaocong Guo

Ron Ho

Stephen C Englund

Thomas G Houck

Walt T Wilser

Ultrasound transducer assemblies and associated systems and method are disclosed herein. In one embodiment, an ultrasound transducer assembly includes at least one matching layer overlies a transducer layer. A plurality of kerfs extends at least into the matching layer. In some aspects, the kerfs are at least partially filled with a filler material that includes microballoons and/or microspheres.

Ultrasound transducer assembly

An ultrasound probe and method for using the same are described. In one embodiment, the ultrasound probe comprises: a probe array assembly having a probe tip; a first enclosure disposed around a portion of the probe array assembly, where the first enclosure has first and second openings and comprises a thermally conductive material; and one or more thermally conductive fins contained within the first enclosure, each of the one or more thermally conductive fins having one end enclosed within the probe array assembly and a portion extending away from the probe array assembly and in thermal contact with an inner surface of the first enclosure to create a thermal path from the first opening to the second opening in the first enclosure.

Ultrasound probe

A PMUT ultrasound transducer includes a number of PMUT transmitting elements in a membrane layer. Behind each PMUT transmitting element is a cavity in the membrane layer. The cavities are partially or completely filled with a damping material to reduce ringing of the PMUT transmitting elements. Suitable damping materials include polymers, e.g., soft epoxies, benzocyclobutene or polyimide that are dispersed into the cavities or a phase changing material such as Parylene that precipitates out of a gas phase as a polymer when cured.

PMUT ultrasound transducer with damping layer

A multi-dimensional transducer array is provided. The multi-dimensional transducer array includes a plurality of elements. First and second kerfs acoustically separate the elements. A first width of the first kerf is larger than a second width of the second kerf.

Transducer array with non-uniform kerfs

Electrical interconnects are provided for CMUTs. For example, electrodes within the silicon substrate, such as the electrodes at the bottom of the void below membranes, are interconnected together within the substrate. The interconnected electrode may then be used as the grounding electrode. By providing interconnection within the substrate and below the membranes, space for vias and the associated connection between the electrodes on an exposed surface of the substrate is minimized. As another example, an electrical conductor is formed on the side of the silicon substrate rather than the top of the substrate. Conductors on the side may allow routing signals from a top surface to a bottom surface without large wire bonding pads. Alternatively, conductors on the edge provide additional space for wire bonding pads. As yet another example, polymer material used as a matching or protection layer is formed on the top surface of the CMUT with electrical traces routed within the polymer. By using multiple layers of polymer, multiple layers of electrical conductors may be routed without interference.

Electrical interconnections and methods for membrane ultrasound transducers

Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.

Electrically conductive matching layers and methods

Backing blocks, transducer arrays and methods are provided for thermal cycle survivability. By decoupling a portion of the backing block from a case used to contain the transducer stack, the greater thermal expansion properties of most backing blocks may be minimized. For example, a rim is formed on the backing block material. The rim is bonded to the case structure while other portions of the backing block remain free of bonding to the case structure. During thermal cycling or other temperature changes, the backing block may be less likely to expand or bulge and crack, delaminate or damage transducer elements or other transducer materials.

Backing, transducer array and method for thermal survival

A multi-dimensional transducer array has pitch along one dimension less than the pitch along a second dimension. The multi-dimensional transducer array with the same or different pitch is manufactured from a plurality of modules. Each of the modules are separately diced and then aligned and combined. Elements of a transducer array are used for isolating a transmit channel from a receive channel. Separate signal lines or traces are provided individually for each element on opposite sides of each element. A transmit channel may connect to one electrode on an element, and the receive channel may connect to an opposite electrode on the element. A multi-dimensional array is provided for time division multiplex processing. A probe houses the multi-dimensional array and a multiplexer.

Growing community of inventors

Woodinville, WA, United States of America

Gregg W Frey