Electro Scientific Industries, Inc.

Gregg Hardy

Yunlong Sun

Hisashi Matsumoto

Jeffrey Howerton

Weisheng Lei

Brian W Baird

Brian C Johansen

A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched COlaser pulses with identical pulse parameters. Real time pulse tailoring is not required; therefore, system complexity and cost may be reduced.

Method of and apparatus for laser drilling holes with improved taper

An area of reduced thickness is formed in a panel, and a pattern of microscopic holes are formed in the area. The holes are filled with a light transmissive material such as a curable polymer. The thinned area may also be filled with a polymer to reinforce the thinned area and the polymer may be colored to add color to light transmitted through the pattern. The panel can form a portion of a housing surrounding a lighting source that makes the holes visible when lit.

Panel with micro-hole pattern in a structurally thin portion

An improved method and apparatus for drilling vias in electronic substrates with laser pulses is presented which uses one or more tailored pulses to reduce debris remaining in the via while maintaining system throughput and avoiding damage to the substrate. A tailored pulse is a laser pulse that features a power spike having a peak power 10% higher than the average power of the pulse and lasting less than 50% of the duration of the pulse. Methods and apparatuses for creating tailored pulses by slicing longer duration pulses are shown.

Method and apparatus for laser drilling holes with tailored laser pulses

A method for producing an area of light transmissivity in a generally opaque panel comprises forming an area of reduced thickness in the panel, laser drilling an array of microscopic holes in the area and thereafter filling the holes with a light transmissive material such as a curable polymer. The thinned area may also be filled with a polymer to reinforce the thinned area, and the polymer may be colored to add color to light transmitted through the pattern.

Growing community of inventors

Portland, OR, United States of America

Gregg Hardy