S3 Incorporated, Inc.

Gregg Bardel

Nalini Ranjan

Yi-Hen Wei

Henry Yang

Improved conductive pads and conductive lines for use on integrated circuit chips include one or more conductive layers having a wider width than convention conductive lines for improved current and power carrying capacity. A layer of insulating and shock resistant is included over said layers of wider width, and additional pads can be formed on said layer of insulating and shock resistant material. Additional improved conductive pads are formed on the integrated circuit chip over a region containing a conductive line. The improved pads and conductive lines provide high power and current carrying capacity, and simultaneously allow for high pad density on an integrated circuit chip. Said pads and conductive lines can include a layer of metal which is electrically insulated using upper and lower layers of insulating material, with this layer of metal providing shock resistance particularly to such lower layer of insulating material.

Growing community of inventors

San Jose, CA, United States of America

Gregg Bardel