Ami Semiconductor, Inc.

Semiconductor Components Industries, LLC

Greg Scott

J Marcos Laraia

Joseph J Walsh

Thierry Coffi Hervé Yao

Pierre André Claude Gassot

Philip John Cacharelis

A double-sided extended drain field effect transistor that includes a gate terminal overlying a channel region in a substrate. The substrate includes a drain region of a first carrier type that is laterally separated from the channel region by a first RESURF region of the first carrier type, and a source region of the first carrier type that is laterally separated from the channel region by a second RESURF region of the first carrier type. Regions of the first carrier type may also be disposed laterally adjacent to the source and drain regions on the opposite lateral side as compared to the RESURF regions. This configuration improves the reverse bias breakdown voltage of the transistor.

Double-sided extended drain field effect transistor

A closed loop DC-to-DC converter circuit that includes an open loop DC-to-DC converter circuit configured to provide charge on its output terminal. A voltage-controlled inverse-resistance component is coupled to the output terminal of the open loop DC-to-DC converter circuit, such that the greater the voltage differential across the component, the lower the resistance provided by the component. A feedback system provides a signal to a control terminal of the open-loop DC-to-DC converter circuit that is dependent on the current provided through the voltage-controlled inverse-resistance component. Specifically, the signal provided by the feedback system causes the open loop DC-to-DC converter circuit to generate more current on the output terminal when there is less current passing through the voltage-controlled inverse-resistance component, and less or no current on the output terminal when there is more current passing through the voltage-controlled inverse-resistance component.

Closed loop direct current to direct current converter that does not require voltage reference

An EEPROM cell that combines a FET transistor and a capacitor. The transistor has a well that is shared by potentially all of the EEPROM cells in the array thereby reducing size. A gate terminal is formed over the well. Source and drain terminals are formed in the well. The well is isolated from the gate terminal using a dielectric layer. A first terminal of the capacitor is connected to the gate terminal using a dielectric layer. A first terminal of the capacitor is connected to the gate terminal, and may be oppositely doped from the gate terminal to improve retention. The second terminal is formed by a second well that is underneath the first terminal and isolated from the first terminal. The capacitance may be increased without area increase by forming a metal layer over the first terminal and separated from the first terminal by a thick dielectric layer, and connected to the second well via a conductive via.

High reliability electrically erasable and programmable read-only memory (EEPROM)

Silicon-based voltage reference circuits that generate a temperature independent voltage reference that is less than even the silicon bandgap potential. The voltage reference circuit includes a diode-connected metal-silicon Schottky diode that is biased with a current. In this configuration, the anode terminal of the Schottky diode is a CTAT voltage source in this configuration. The anode terminal has a voltage at zero degrees Kelvin at the barrier height of the Schottky diode, which may differ depending on the metal chosen, but in most cases is less than the bandgap potential of silicon. The voltage reference circuit also includes a PTAT voltage source. The PTAT voltage may be generated in a variety of ways. An amplifier amplifies the PTAT voltage, and a summer adds the CTAT voltage to the amplified PTAT voltage to generate the temperature stable voltage reference.

Temperature stable voltage reference circuit using a metal-silicon Schottky diode for low voltage circuit applications

An integrated overvoltage and reverse voltage protection circuit that includes two p-channel double-sided extended drain transistors coupled to a high voltage source, each having their n-well coupled through a resistor to the high voltage source. For voltage regulation, a voltage divider is coupled in series with a first of these transistors, while the drain of the second transistor is coupled to the gate of the first transistor. For voltage blocking, the voltage divider may span the entire supply voltage. An n-channel transistor couples the second p-channel transistor to a low voltage source. A middle node in the voltage divider is coupled to one input of a comparator, with a reference voltage coupled to the second input. The comparator output drives the gate terminal of the n-channel transistor. A load to be protected may be disposed in parallel with the voltage divider.

Double-sided extended drain field effect transistor, and integrated overvoltage and reverse voltage protection circuit that uses the same

An EEPROM memory cell that includes two floating gate transistors. Each of the drain terminals of the transistors is coupled to a corresponding differential bit line. The source terminal of both transistors are coupled to a common current source or sink. Each of the control gate terminals are coupled to a corresponding word line, which may be the same as or different than the corresponding word line that the other control terminal is connected to. The floating gate transistor may be five-terminal devices that include an additional well terminal. In that case, a different set of bit lines is used to program the EEPROM memory cell as are used to read the EEPROM memory cell. While the drain terminals are coupled to the differential read bit lines, each of the well terminals is coupled to a corresponding differential program bit line.

Growing community of inventors

Inkom, ID, United States of America

Greg Scott