Medtronic, Inc.

Greg Garlough

Kevin R Seifert

Gregory A Boser

A medical device lead. The lead includes one or more jacketed conductive elements. The jacket comprises one or more covers. A first cover of polyether ketone (PEEK) is in direct contact with the at least one conductive element. At least one conductive element and a PEEK cover are coiled. The coiled conductive element can substantially retain its original coiled shape.

Medical electrical lead

A medical device lead. The lead includes one or more jacketed conductive elements. The jacket comprises one or more covers. A first cover of polytetrafluoroethylene (PTFE) is in direct contact with the at least one conductive element. The at least one conductive element and the PTFE cover are coiled. The coiled conductive element can substantially retain its original coiled shape.

Plasma etching of a liquid dielectric material such as a polyurethane solution results in volatile byproducts that are deposited onto the surface of an inert substrate. The surface treatment increases adhesiveness so that the surface of the inert material may be bonded to another material. Portions of a medical device comprising an inert substrate such as a fluoropolymer may therefore be securely affixed to other portions of the medical device formed of polymeric, metallic, or ceramic materials.

Plasma deposition to increase adhesion

Plasma etching of a polymeric dielectric material such as polyurethane results in volatile byproducts that are deposited onto the surface of an inert substrate. The surface treatment increases adhesiveness so that the surface of the inert material may be bonded to another material. Portions of a medical device comprising an inert substrate such as a fluoropolymer may therefore be securely affixed to other portions of the medical device formed of polymeric, metallic, or ceramic materials.

A method of manufacture of a medical device lead. The lead includes one or more jacketed conductive elements. The jacket comprises one or more covers. The jacketed conductive element is formed by introducing a polymeric material over a conductive element, coupling the conductive element around a mandrel to form a coil shape, annealing the polymeric material over the at least one conductive element and setting a coiled shape in the at least one conductive element; and then removing the at least one conductive element from the mandrel. The coiled conductive element as manufactured thus substantially retains its original coiled shape.

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Bloomington, MN, United States of America

Greg Garlough