Texas Instruments Corporation

Other

Greg Charles Baldwin

Kamel Benaissa

Shashank Sureshchandra Ekbote

Youn Sung Choi

Henry Litzmann Edwards

Robert L Pitts

Shaofeng Yu

Alwin J Tsao

Vineet Mishra

Song Zhao

Borna J Obradovic

Ananth Kamath

Sarah Liu

Mahalingam Nandakumar

Freidoon Mehrad

Weize W Xiong

Pr Chidambaram

Periannan Chidambaram

Andrew T Appel

Younsung Choi

Methods and apparatus for quantum point contacts. In an arrangement, a quantum point contact device includes at least one well region in a portion of a semiconductor substrate and doped to a first conductivity type; a gate structure disposed on a surface of the semiconductor substrate; the gate structure further comprising a quantum point contact formed in a constricted area, the constricted area having a width and a length arranged so that a maximum dimension is less than a predetermined distance equal to about 35 nanometers; a drain/source region in the well region doped to a second conductivity type opposite the first conductivity type; a source/drain region in the well region doped to the second conductivity type; a first and second lightly doped drain region in the at least one well region. Additional methods and apparatus are disclosed.

Transistor with quantum point contact

Methods and apparatus for artificial exciton devices. An artificial exciton device includes a semiconductor substrate; at least one well region doped to a first conductivity type in a portion of the semiconductor substrate; a channel region in a central portion of the well region; a cathode region in the well region doped to a second conductivity type; an anode region in the well region doped to the first conductivity type; a first lightly doped drain region disposed between the cathode region and the channel region doped to the first conductivity type; a second lightly doped drain region disposed between the anode region and the channel region doped to the second conductivity type; and a gate structure overlying the channel region, the gate structure comprising a gate dielectric layer lying over the channel region and a gate conductor material overlying the gate dielectric. Methods are disclosed.

Methods and apparatus for artificial exciton in CMOS processes

An integrated circuit with DSL borders perpendicular to the transistor gates primarily inside the nwell and with DSL borders parallel to the transistor gates primarily outside the nwell. A method for forming an integrated circuit with DSL borders perpendicular to the transistor gates primarily inside the nwell and with DSL borders parallel to the transistor gates primarily outside the nwell.

Integrated circuit with dual stress liner boundary

An integrated circuit and method with a single stress liner film and a stress relief implant where the distance of the stress relief implant to the transistors is adjusted for improved transistor performance.

Optimized layout for relaxed and strained liner in single stress liner technology

Methods and apparatus for quantum point contacts in CMOS processes

A method for adding a low TCR resistor to a baseline CMOS manufacturing flow. A method of forming a low TCR resistor in a CMOS manufacturing flow. A method of forming an n-type and a p-type transistor with a low TCR resistor in a CMOS manufacturing flow.

Low temperature coefficient resistor in CMOS flow

An integrated circuit with DSL borders perpendicular to the transistor gates primarily inside the nwell and with DSL borders parallel to the transistor gates primarily outside the nwell. A method for forming an integrated circuit with DSL borders perpendicular to the tranistor gates primarily inside the nwell and with DSL borders parallel to the transistor gates primarily outside the nwell.

Method for improving device performance using dual stress liner boundary

An integrated circuit with DSL borders perpendicular to the tranistor gates primarily inside the nwell and with DSL borders parallel to the transistor gates primarily outside the nwell. A method for forming an integrated circuit with DSL borders perpendicular to the tranistor gates primarily inside the nwell and with DSL borders parallel to the transistor gates primarily outside the nwell.

Electrical device structures constructed in an isolated p-well that is wholly contained within a core n-well. Methods of forming electrical devices within an isolated p-well that is wholly contained within a core n-well using a baseline CMOS process flow.

Method of building compensated isolated P-well devices

An integrated circuit with a core PMOS transistor formed in a first n-well and an isolated DENMOS (iso-DENMOS) transistor formed in a second n-well where the depth and doping of the first and second n-wells are the same. A method of forming an integrated circuit with a core PMOS transistor formed in a first n-well and an iso-DENMOS transistor formed in a second n-well where the depth and doping of the first and second n-wells are the same.

Compensated isolated p-well DENMOS devices

An integrated circuit is disclosed having symmetric and asymmetric MOS transistors of the same polarity, oriented perpendicularly to each other, formed by concurrent halo ion, LDD ion and/or S/D ion implant processes using angled, rotated sub-implants which vary the tilt angle, dose and/or energy between rotations. Implanted halo, LDD and/or S/D source and drain regions formed by angled subimplants may have different extents of overlap with, or lateral separation from, gates of the two types of transistors, producing transistors with two different sets of electrical properties. A process for concurrently fabricating the two types of transistors is also disclosed. Specific embodiments of processes for concurrently forming symmetric and asymmetric transistors are disclosed.

Low cost transistors using gate orientation and optimized implants

Various embodiments provide methods for fabricating dual supply voltage CMOS devices with a desired I/O transistor threshold voltage. The dual supply voltage CMOS devices can be fabricated in a semiconductor substrate that includes isolated regions for a logic NMOS transistor, a logic PMOS transistor, an I/O NMOS transistor, and an I/O PMOS transistor. Specifically, the fabrication can first set and/or adjust the threshold voltage (V) of each of the I/O NMOS transistor and the I/O PMOS transistor to a desired level. Logic NMOS and logic PMOS transistors can then be formed with I/O NMOS and I/O PMOS transistors masked without affecting the set/adjusted Vof the I/O transistors.

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Integrated circuit inductors () are formed by interconnecting various metal layers () in an integrated circuit with continuous vias (). Using continuous vias () improves the Q factor over existing methods for high frequency applications. The contiguous length of the continuous vias should be greater than three percent of the length of the inductor ().

Growing community of inventors

Plano, TX, United States of America

Greg Charles Baldwin