United Technologies Corporation

Rtx Corporation

Delavan Inc.

Raytheon Technologies Corporation

Greg C Ojard

Harry E Eaton

Shantikumar V Nair

Michael G McCaffrey

Aaron T Nardi

Michael A Klecka

Ozgur Erdinc

Amit Surana

Kevin L Rugg

Patrick Louis Clavette

Yasser A Gowayed

Jerry Ding

A system comprising a computer readable storage device readable by the system, tangibly embodying a program having a set of instructions executable by the system to perform the following steps for indication confirmation for detecting a sub-surface defect, the set of instructions comprising: an instruction to initialize a transducer starting location and a transducer orientation responsive to a prior determination of a potential flaw location; an instruction to optimize an observation point of the transducer responsive to the transducer starting location and the transducer orientation responsive to a flaw response model; an instruction to move the transducer to the observation point location and orientation; an instruction to collect the scan data at the observation point location and orientation; and an instruction to analyze the scan data to extract a measure of the flaw response model; and an instruction to update the flaw response model.

System and method for automated indication confirmation in ultrasonic testing

An airfoil includes a core with a first Young's Modulus; and an outer section at least partially surrounding the core with a second Young's Modulus, wherein the first Young's Modulus is higher than the second Young's Modulus.

Composite airfoil

A system for quality monitoring of additive manufacturing includes an acoustic emission (AE) sensor configured to be attached to an additive manufacturing substrate and to output a sensor signal indicative of acoustic vibrations received at the AE sensor and an AE module. The AE module is configured to receive the sensor signal from the AE sensor and process the sensor signal to determine at least one characteristic of an additive manufacturing process and/or an additively manufactured article.

Systems for quality monitoring of additive manufacturing

A bond layer and a further layer on the bond layer, the bond layer comprising a silicon layer having a dispersion of fibers, wherein at least some of the fibers extend between the bond layer and the further layer. The fibers are formed from a material selected from the group consisting of (1) alumina, (2) yttria, (3) aluminum silicate, (4) silicon carbide, (5) silicon nitride, (6) compounds of rare earth elements, alkaline earth elements, aluminum, silicon, oxygen, yttrium, nitrogen, niobium, tantalum, hafnium, zirconium, carbon and mixtures of (1) thru (6).

Bond layer for silicon containing substrate

A bond layer for a silicon based substrate comprises a silicon layer having a dispersion of particulate material therein, wherein the particulate material is selected from the group consisting of (1) alumina, (2) yttria, (3) aluminum silicate, (4) compounds of rare earth elements, alkaline earth elements, aluminum, oxygen, yttrium, nitrogen, niobium, tantalum, hafnium, zirconium, carbon, silicon and mixtures thereof.

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Vernon, CT, United States of America

Greg C Ojard