Seagate Technology Incorporated

Greg Arthur Schmitz

Robbee Lee Grimm

Venkateswara R Inturi

Aaron Michael Collins

Jeffrey Robert O'Konski

Garrick F Shurts

Gregory P Shaffer

Andrew D Habermas

Jeff O'Konski

Charles J Mann

Andrew J Hakanson

A method of controlling a shape and size of at least one solder joint of a magnetic recording head that includes a trailing surface and a plurality of bond pads, wherein each bond pad comprises a base layer comprising a top surface and a top edge, the method including the steps of forming at least one solder dam by covering a portion of the top surface of the base layer of at least one of the bond pads with a coating layer that comprises a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads, thereby defining a coated portion and an uncoated portion of the base layer, and applying solder material to the uncoated portion of the base layer adjacent to the solder dam so that the coating layer constrains movement of the solder material beyond the uncoated portion.

Methods of controlling a shape and size of solder joints of magnetic recording heads

A magnetic recording head is provided including a body with a trailing surface, a plurality of bond pads in a row, each of which is spaced by a gap from an adjacent bond pad along a width of the trailing surface. Each bond pad includes a base layer having a top surface, a coating layer covering at least a portion of the top surface of the base layer, two side edges spaced from each other across a width of the bond pad, wherein a width of the gap between adjacent bond pads is defined by one side edge of each of two adjacent bond pads, a top edge extending between the two side edges, and at least one solder dam comprising a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads.

Electrically conductive solder non-wettable bond pads in head gimbal assemblies

The present disclosure involves electronic test structures, and related methods, for use with one or more magnetoresistive elements at least at the wafer stage of slider manufacturing.

Electronic test structures for one or more magnetoresistive elements, and related methods

A method includes depositing a plurality of layers over a substrate. The layers include read sensor layers and an electrically conductive layer substantially coplanar with the read sensor layers and substantially surrounding the read sensor layers. The electrically conductive layer is in contact with at least one of the read sensor layers. The electrically conductive layer provides an electrical path between the at least one of the read sensor layers and ground. The method further includes forming an isolation structure around the read sensor layers by removing a portion of the electrically conductive layer substantially surrounding the read sensor layers. The isolation structure is substantially coplanar with the read sensor layers and substantially surrounds the read sensor layers. The isolation structure breaks the electrical path between the at least one of the read sensor layers and the ground.

Electrical isolation of read sensors during fabrication

A method of manufacturing a magnetic read-write head, including the steps of presenting a row bar to a processing location, the row bar including an air bearing surface, at least one read-write head, at least one electronic lapping guide, and at least one trigger device, wherein each electronic lapping guide is positioned at a different distance from the air bearing surface than each trigger device, and wherein the read-write head and at least one of the trigger devices include a multi-layer stack of materials; lapping the air bearing surface while measuring the electrical resistance of at least one electronic lapping guide and at least one trigger device until the resistance measurement of the trigger device provides an open circuit reading, and measuring an offset resistance value of the at least one electronic lapping guide concurrently with the measurement of the open circuit reading by the trigger device.

Growing community of inventors

Princeton, MN, United States of America

Greg Arthur Schmitz