Siemens Medical Solutions Usa, Inc.

Grazyna M Palczewska

Stephen Roy Barnes

Walter T Wilser

Gregg W Frey

Sean T Hansen

Sevig Ayter

Mirsaid Seyed Bolorforosh

Xiaocong Guo

Todor Sheljaskow

Stephen C Englund

Ron Ho

Thomas G Houck

CMUT elements are formed on a substrate. Electrical conductors are formed to interconnect between different portions of the substrate. The substrate is then separated into pieces while maintaining the electrical connections across the separation. Since the conductors are flexible, the separated substrate slabs may be positioned on a curved surface while maintaining the electrical interconnection between the slabs. Large curvatures may be provided, such as associated with forming a multidimensional transducer array for use in a catheter. The electrical interconnections between the different slabs and elements may allow for a walking aperture arrangement for three dimensional imaging.

Curved capacitive membrane ultrasound transducer array

Electrical interconnects are provided for CMUTs. For example, electrodes within the silicon substrate, such as the electrodes at the bottom of the void below membranes, are interconnected together within the substrate. The interconnected electrode may then be used as the grounding electrode. By providing interconnection within the substrate and below the membranes, space for vias and the associated connection between the electrodes on an exposed surface of the substrate is minimized. As another example, an electrical conductor is formed on the side of the silicon substrate rather than the top of the substrate. Conductors on the side may allow routing signals from a top surface to a bottom surface without large wire bonding pads. Alternatively, conductors on the edge provide additional space for wire bonding pads. As yet another example, polymer material used as a matching or protection layer is formed on the top surface of the CMUT with electrical traces routed within the polymer. By using multiple layers of polymer, multiple layers of electrical conductors may be routed without interference.

Electrical interconnections and methods for membrane ultrasound transducers

A multi-dimensional transducer array has pitch along one dimension less than the pitch along a second dimension. The multi-dimensional transducer array with the same or different pitch is manufactured from a plurality of modules. Each of the modules are separately diced and then aligned and combined. Elements of a transducer array are used for isolating a transmit channel from a receive channel. Separate signal lines or traces are provided individually for each element on opposite sides of each element. A transmit channel may connect to one electrode on an element, and the receive channel may connect to an opposite electrode on the element. A multi-dimensional array is provided for time division multiplex processing. A probe houses the multi-dimensional array and a multiplexer.

Multi-dimensional transducer arrays and method of manufacture

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Bellevue, WA, United States of America

Grazyna M Palczewska