Intel Corporation

Grant W McFarland

Jonathan M Eastep

Federico Ardanaz

David M Wu

Talal K Jaber

Anil K Sabbavarapu

Tozer J Bandorawalla

Fuat Keceli

Paven R Sunkerneni

Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for Thermal Design Power (TDP) rebalancing among thermally-coupled processors and non-thermally-coupled processors, providing computing efficiency or homogeneity with respect to, including but not limited to, thermal requirements, power consumption, and processor operations. The TDP rebalancing may include implementing management circuitry and configuration control circuitry. Other embodiments may be described and claimed.

Techniques in performance and efficiency improvements of processors in a cooling system

According to some embodiments, a circuit includes a Domino state element, a master latch to receive a first clock signal and to store a value in the Domino state element in response to the first clock signal, and a slave latch to receive a second clock signal and to output the value in response to the second clock signal. Some embodiments provide a first state element coupled to a first node, a master latch coupled to the first state element, the master latch to receive a first storage signal, a first load signal, a first clock signal and a first scan value signal, a second state element coupled to a second node, the second node sequential to the first node, and a slave latch coupled to the second state element, the slave latch to receive a second storage signal, a second load signal, a second clock signal and a second scan value signal.

Scan cell systems and methods

Growing community of inventors

Austin, TX, United States of America

Grant W McFarland