Unisys Corporation

Burroughs, Inc.

Grant M Smith

Peter P Klein

Samuel R Romania

Mark W Wessel

Keith Mease

Mark R Treiber

Ronald Thomas Gibbs

Vladimir K Tamarkin

Daniel A Jochym

N Kenneth Newman

Terry W Louth

George J Sprenkle

John A Helgenberg

John Ruscitelli

Vladimir M Tamarkin

A fan tray assembly. The assembly comprises a module, housing electronic components that require cooling, and one or more fan trays having fans that direct a cooling air flow through the module. The assembly facilitates easy and fast removal and replacement of the fan trays with respect to the module. These desirable attributes are achieved by five main features of the assembly: (1) a retaining slot-and-tab engagement pivotally attaching each fan tray to one side of the module, (2) a channel-in-track automatically aligning each fan tray as it closes against the module, (3) a leaf spring releasably locking each fan tray into a closed position, (4) a floating power-and-signal connector on each fan tray electrically and mechanically engaging a corresponding receptacle on the module, and (5) a pull ring facilitating manipulation of each fan tray.

Fan tray assembly

An apparatus and method are provided for dissipating heat from an electronic component mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. A heat sink is configured to be mounted in thermal contact with the electronic component. An electrical conductor is operatively connected to the heat sink and configured to provide electrical contact between the heat sink and a surface of the conductive enclosure, thereby at least partially shielding the electromagnetic radiation generated by the electronic component.

Method and apparatus for EMI shielding

A computer subassembly is configured to be mounted within a rack along an insertion axis. The computer subassembly includes a chassis configured for insertion into and removal from the rack along the insertion axis, wherein the chassis at least partially defines an interior. An interconnect assembly is mounted within or adjacent the interior of the chassis, and the interconnect assembly is oriented along a plane that is substantially parallel to the insertion axis. At lease one circuit assembly is positioned at least partially within the interior of the chassis and is connected to the interconnect assembly. The circuit assembly is oriented in a plane substantially parallel to the insertion axis. A source of cooling air is positioned to direct cooling air through the interior of the chassis along the insertion axis.

Computer system and method configured for improved cooling

A packaging configuration is provided for a computer system that is adapted for operating multiple operating systems in different partitions of the computer system. The packaging configuration includes a main chassis having a main circuit board. The packaging configuration also includes a processor assembly configured for insertion into the main chassis. The processor assembly has a circuit board for connection to the main circuit board upon insertion of the processor assembly. The packaging configuration also includes a processor subassembly configured for insertion into the processor assembly. The processor subassembly includes a circuit board and a processor and is configured for connection with a circuit board in the processor assembly upon insertion of the processor subassembly. The processor assembly is removable from the main chassis without powering down the computer system, and the processor subassembly is removable from the processor assembly without powering down the computer system.

Modular packaging configuration and system and method of use for a computer system adapted for operating multiple operating systems in different partitions

An apparatus directs airflow adjacent a circuit board to provide cooling and provides shielding for the circuit board to reduce EMI. The apparatus comprises a barrier for directing airflow and a conductive layer, electrically grounded and physical associated with the barrier, for providing shielding for the circuit board to reduce EMI.

Apparatus and method for shielding a circuit board

A heat sink is provided for transferring heat to air flowing from an upstream path. The heat sink includes a support portion and a plurality of fins extending from the support portion. The fins and the support portion together define channels at least one of which has a portion angled with respect to the upstream path of flowing air. Redirection of the flowing air from the upstream path to at least one downstream path is thereby facilitated.

Forced convection heat sink system with fluid vector control

A structure for removing heat from a packaged electronic component. The structure includes three, main elements. First, a heat sink has a pedestal with opposing ends and a plurality of fins separated by spaces and disposed on the pedestal. The heat sink dissipates heat generated by the packaged electronic component. Second, parallel rails are disposed adjacent the opposing ends of the pedestal, each rail having a catch. Third, a spring clip has (a) end hooks which engage the catches to retain the spring clip on the rails, and (b) a strut extending between the hooks, fitting into the space between adjacent fins, and including an apex which contacts substantially centrally the pedestal and applies a force pressing the heat sink toward the packaged electronic component. Thus, the heat sink is removably attached at least indirectly to the packaged electronic component. Also disclosed is a method of using the structure.

Retention of heat sinks on electronic packages

An apparatus is provided for dissipating heat from an electronic component, such as a processor, that is mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. The apparatus includes a heat sink that is configured to be mounted to a surface of the electronic component. The apparatus also includes a conductor connected to the heat sink. The conductor is configured to provide electrical contact between the heat sink and a surface of the conductive enclosure. Accordingly, the apparatus at least partially shields the electromagnetic radiation generated by the electronic component. A corresponding method is also provided.

Apparatus and method for shielding electromagnetic radiation

This invention provides a heat sink for dissipating heat from an electronic component to be cooled by air flow. The heat sink includes a base configured to be mounted to the electronic component to receive heat transferred from the electronic component. The base has a center extending along the direction of air flow. The heat sink also includes a plurality of fins projecting from the base. Each of two adjacent fins is positioned on opposite sides of the center of the base and is spaced laterally from the center of the base. The adjacent fins define a gap extending across the center of the base. The gap between the adjacent fins reduces the temperature increase of air flowing adjacent the center of the base. This invention also provides a circuit assembly and a method for cooling an electronic component.

Method and apparatus for heat dissipation in a multi-processor module

An air mover system is provided having plural air movers each mounted along an air flow path. Each of the air movers includes means mounted for forward rotation to generate forward air flow. Each of the air movers also includes means for preventing reverse rotation of the air flow generating means, thereby reducing reverse air flow.

Air mover system with reduced reverse air flow

A system is provided for cooling electronic components and for localized cooling of selected electronic components. An air mover is mounted adjacent to an exhaust opening in order to generate a low pressure zone within the cabinet's interior. An inlet opening is defined in a cabinet so that the air mover can generate a serial air flow path extending from the inlet opening to the exhaust opening for cooling of electronic components within the cabinet. At least one secondary opening is defined in the cabinet so that the air mover can generate a parallel air flow path, for cooling of selected electronic components, that extends from the secondary opening and then joins the serial air flow path.

Parallel cooling of high power devices in a serially cooled evironment

A stacked circuit assembly is provided for mounting memory modules in close proximity to an integrated circuit. The assembly includes an integrated circuit mounted on a printed circuit board and at least one stacked printed circuit board mounted in substantially parallel arrangement with respect to the printed circuit board on which the integrated circuit is mounted. A memory module is mounted for electrical connection on a surface of the stacked printed circuit board and an interface connector is mounted on facing surfaces of the printed circuit board and the stacked printed circuit board, thereby providing means for both mechanical and electrical connection between the boards. The integrated circuit and the memory module are mounted in parallel relationship with respect to one another for electrical interconnection through the boards and the interface connectors, thereby reducing the physical distance between the integrated circuit and the memory module.

Stackable high density RAM modules

An apparatus is provided for dissipating heat from a stacked circuit board assembly. The apparatus includes circuit boards that are oriented in spaced planes that extend substantially parallel to one another. A heat transfer means connected to the circuit boards transfers heat between the circuit boards. A heat dissipation means connected to at least one of the circuit boards dissipates at least a portion of the transferred heat.

Stacked circuit board assembly adapted for heat dissipation

The cooling of a heat generating component mounted outside of the main portion of an enclosure that is cooled using an airstream created by an active air handler is disclosed. The invention is preferably used to cool components such as displays that generate heat, but which are mounted outside the enclosure that houses the main electronics package. The disclosed system, permits inlet air to enter via a vent, and a first duct formed by a baffle routes the inlet air along the back of the displays, removing excess heat. The air is then channeled by a second duct to an area adjacent the enclosure. Since the airstream within the enclosure has created a low pressure area, the passive air stream infiltrates the enclosure and mixes with the main airstream. The disclosed system thus cools the remotely mounted components passively, without requiring additional air handlers or diminishing the pressure and velocity within the enclosure.

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Bryn Athyn, PA, United States of America

Grant M Smith